DIFFUSION BONDING OF PURE METAL BODIES

A method includes applying a bond layer of a first chemical composition to a first surface of a first metal body. The metal body is of a second chemical composition. The method further includes disposing a second metal body of the second chemical composition against the first metal body such that th...

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Bibliographische Detailangaben
Hauptverfasser:	BEHNKE, Joseph, SOMMERS, Joseph
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	APPARATUS THEREFOR CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method includes applying a bond layer of a first chemical composition to a first surface of a first metal body. The metal body is of a second chemical composition. The method further includes disposing a second metal body of the second chemical composition against the first metal body such that the bond layer is between the first surface of the first metal body and a second surface of the second metal body. The metal bodies are resistant to diffusion bonding. The bond layer facilitates diffusion bonding of the metal bodies. The method further includes heating the first metal body and the second metal body. The method further includes applying pressure to press the second metal body against the first metal body. The method further includes generating a diffusion bond between the metal bodies, responsive to the heating and the applying of pressure for a duration. Procédé comprenant l'application d'une couche de liaison d'une première composition chimique à une première surface d'un premier corps métallique. Le corps métallique est d'une seconde composition chimique. Le procédé comprend en outre la disposition d'un second corps métallique de la seconde composition chimique contre le premier corps métallique de telle sorte que la couche de liaison se trouve entre la première surface du premier corps métallique et une seconde surface du second corps métallique. Les corps métalliques sont résistants à la liaison par diffusion. La couche de liaison facilite la liaison par diffusion des corps métalliques. Le procédé comprend en outre le chauffage du premier corps métallique et du second corps métallique. Le procédé comprend en outre l'application d'une pression pour presser le second corps métallique contre le premier corps métallique. Le procédé comprend en outre la génération d'une liaison par diffusion entre les corps métalliques, en réponse au chauffage et à l'application d'une pression pendant une durée.