PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
The present disclosure relates to a photosensitive resin composition for permanent resists containing: (A) an acid-modified vinyl group-containing resin, (B) an elastomer, (C) a photoinitiator, (C) a curing agent, and (E) an inorganic filler comprising a surface-treated filler. La présente invention...
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| creator | SAWAMOTO Hayato YAMASHITA Naoki NOMOTO Shuji |
| description | The present disclosure relates to a photosensitive resin composition for permanent resists containing: (A) an acid-modified vinyl group-containing resin, (B) an elastomer, (C) a photoinitiator, (C) a curing agent, and (E) an inorganic filler comprising a surface-treated filler.
La présente invention concerne une composition de résine photosensible pour réserves permanentes contenant : (A) une résine contenant un groupe vinyle modifié par un acide, (B) un élastomère, (C) un photoinitiateur, (D) un agent de durcissement et (E) une charge inorganique comprenant une charge traitée en surface.
本開示は、（Ａ）酸変性ビニル基含有樹脂、（Ｂ）エラストマー、（Ｃ）光重合開始剤、（Ｄ）硬化剤、及び（Ｅ）表面処理フィラーを含む無機フィラーを含有する、永久レジスト用の感光性樹脂組成物に関する。 |
| format | Patent |
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La présente invention concerne une composition de résine photosensible pour réserves permanentes contenant : (A) une résine contenant un groupe vinyle modifié par un acide, (B) un élastomère, (C) un photoinitiateur, (D) un agent de durcissement et (E) une charge inorganique comprenant une charge traitée en surface.
本開示は、（Ａ）酸変性ビニル基含有樹脂、（Ｂ）エラストマー、（Ｃ）光重合開始剤、（Ｄ）硬化剤、及び（Ｅ）表面処理フィラーを含む無機フィラーを含有する、永久レジスト用の感光性樹脂組成物に関する。</description><language>eng ; fre ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230727&DB=EPODOC&CC=WO&NR=2023140293A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230727&DB=EPODOC&CC=WO&NR=2023140293A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAWAMOTO Hayato</creatorcontrib><creatorcontrib>YAMASHITA Naoki</creatorcontrib><creatorcontrib>NOMOTO Shuji</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD</title><description>The present disclosure relates to a photosensitive resin composition for permanent resists containing: (A) an acid-modified vinyl group-containing resin, (B) an elastomer, (C) a photoinitiator, (C) a curing agent, and (E) an inorganic filler comprising a surface-treated filler.
La présente invention concerne une composition de résine photosensible pour réserves permanentes contenant : (A) une résine contenant un groupe vinyle modifié par un acide, (B) un élastomère, (C) un photoinitiateur, (D) un agent de durcissement et (E) une charge inorganique comprenant une charge traitée en surface.
本開示は、（Ａ）酸変性ビニル基含有樹脂、（Ｂ）エラストマー、（Ｃ）光重合開始剤、（Ｄ）硬化剤、及び（Ｅ）表面処理フィラーを含む無機フィラーを含有する、永久レジスト用の感光性樹脂組成物に関する。</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7sKwkAQRdNYiPoPA7YR8rBJuWYnZsGdCZuJKUOQtRINxB_wz41iJRZW93A4dx48qpKFa6TaiDkiOKwNQc624pdhCuGrwANaJJm8MySooTUT7GHHyukQFGmwKCVrKNiBVdQUKpfm3fy6LIPZub-MfvXZRbAuUPJy44db58ehP_mrv3ctJ1GSxtsoyVIVp_9VTxQePeI</recordid><startdate>20230727</startdate><enddate>20230727</enddate><creator>SAWAMOTO Hayato</creator><creator>YAMASHITA Naoki</creator><creator>NOMOTO Shuji</creator><scope>EVB</scope></search><sort><creationdate>20230727</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD</title><author>SAWAMOTO Hayato ; YAMASHITA Naoki ; NOMOTO Shuji</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023140293A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2023</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAWAMOTO Hayato</creatorcontrib><creatorcontrib>YAMASHITA Naoki</creatorcontrib><creatorcontrib>NOMOTO Shuji</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAWAMOTO Hayato</au><au>YAMASHITA Naoki</au><au>NOMOTO Shuji</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD</title><date>2023-07-27</date><risdate>2023</risdate><abstract>The present disclosure relates to a photosensitive resin composition for permanent resists containing: (A) an acid-modified vinyl group-containing resin, (B) an elastomer, (C) a photoinitiator, (C) a curing agent, and (E) an inorganic filler comprising a surface-treated filler.
La présente invention concerne une composition de résine photosensible pour réserves permanentes contenant : (A) une résine contenant un groupe vinyle modifié par un acide, (B) un élastomère, (C) un photoinitiateur, (D) un agent de durcissement et (E) une charge inorganique comprenant une charge traitée en surface.
本開示は、（Ａ）酸変性ビニル基含有樹脂、（Ｂ）エラストマー、（Ｃ）光重合開始剤、（Ｄ）硬化剤、及び（Ｅ）表面処理フィラーを含む無機フィラーを含有する、永久レジスト用の感光性樹脂組成物に関する。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
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