METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AND RELATED ASSEMBLIES
Aspects of this disclosure relate to a method of assembly that includes thermally coupling two components. The method includes providing a thermal interface pad between the two components, such as an integrated circuit and a cooling solution. The thermal interface pad can have a star shape, and a pr...
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| creator | NASR, Mohamed BHANDARI, Rishabh MISRAK, Abel NABOVATI, Aydin |
| description | Aspects of this disclosure relate to a method of assembly that includes thermally coupling two components. The method includes providing a thermal interface pad between the two components, such as an integrated circuit and a cooling solution. The thermal interface pad can have a star shape, and a pressure is applied to at least one of the two components. The pressure can cause the star shape thermal interface to expand into a rectangular shape. The expanded rectangular shape does not expand into keep out area positioned around an electronic component of the two components.
Des aspects de la présente invention concernent un procédé d'assemblage qui comprend le couplage thermique de deux composants. Le procédé consiste à fournir un plot d'interface thermique entre les deux composants, tels qu'un circuit intégré et une solution de refroidissement. Le plot d'interface thermique peut avoir une forme d'étoile, et une pression est appliquée à au moins l'un des deux composants. La pression peut amener l'interface thermique en forme d'étoile à se dilater en une forme rectangulaire. La forme rectangulaire étendue ne se dilate pas dans une zone de maintien positionnée autour d'un composant électronique des deux composants. |
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Des aspects de la présente invention concernent un procédé d'assemblage qui comprend le couplage thermique de deux composants. Le procédé consiste à fournir un plot d'interface thermique entre les deux composants, tels qu'un circuit intégré et une solution de refroidissement. Le plot d'interface thermique peut avoir une forme d'étoile, et une pression est appliquée à au moins l'un des deux composants. La pression peut amener l'interface thermique en forme d'étoile à se dilater en une forme rectangulaire. La forme rectangulaire étendue ne se dilate pas dans une zone de maintien positionnée autour d'un composant électronique des deux composants.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230720&DB=EPODOC&CC=WO&NR=2023137006A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230720&DB=EPODOC&CC=WO&NR=2023137006A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NASR, Mohamed</creatorcontrib><creatorcontrib>BHANDARI, Rishabh</creatorcontrib><creatorcontrib>MISRAK, Abel</creatorcontrib><creatorcontrib>NABOVATI, Aydin</creatorcontrib><title>METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AND RELATED ASSEMBLIES</title><description>Aspects of this disclosure relate to a method of assembly that includes thermally coupling two components. The method includes providing a thermal interface pad between the two components, such as an integrated circuit and a cooling solution. The thermal interface pad can have a star shape, and a pressure is applied to at least one of the two components. The pressure can cause the star shape thermal interface to expand into a rectangular shape. The expanded rectangular shape does not expand into keep out area positioned around an electronic component of the two components.
Des aspects de la présente invention concernent un procédé d'assemblage qui comprend le couplage thermique de deux composants. Le procédé consiste à fournir un plot d'interface thermique entre les deux composants, tels qu'un circuit intégré et une solution de refroidissement. Le plot d'interface thermique peut avoir une forme d'étoile, et une pression est appliquée à au moins l'un des deux composants. La pression peut amener l'interface thermique en forme d'étoile à se dilater en une forme rectangulaire. La forme rectangulaire étendue ne se dilate pas dans une zone de maintien positionnée autour d'un composant électronique des deux composants.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr0KwjAQAOAuDqK-w4GzkLag8zW5kEB-JDkInUqROIkW6vvjorvTt3zbpnhiE1WGqIEcSU4xWAl5zEweMGfygxuhWDbAhpJHBzYwJY2S4IoKMChI5JBJ_b6lvG829_mx1sPXXXPUxNKc6vKa6rrMt_qs76nETnR921-EOGPb_7c-f98xvw</recordid><startdate>20230720</startdate><enddate>20230720</enddate><creator>NASR, Mohamed</creator><creator>BHANDARI, Rishabh</creator><creator>MISRAK, Abel</creator><creator>NABOVATI, Aydin</creator><scope>EVB</scope></search><sort><creationdate>20230720</creationdate><title>METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AND RELATED ASSEMBLIES</title><author>NASR, Mohamed ; BHANDARI, Rishabh ; MISRAK, Abel ; NABOVATI, Aydin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023137006A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NASR, Mohamed</creatorcontrib><creatorcontrib>BHANDARI, Rishabh</creatorcontrib><creatorcontrib>MISRAK, Abel</creatorcontrib><creatorcontrib>NABOVATI, Aydin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NASR, Mohamed</au><au>BHANDARI, Rishabh</au><au>MISRAK, Abel</au><au>NABOVATI, Aydin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AND RELATED ASSEMBLIES</title><date>2023-07-20</date><risdate>2023</risdate><abstract>Aspects of this disclosure relate to a method of assembly that includes thermally coupling two components. The method includes providing a thermal interface pad between the two components, such as an integrated circuit and a cooling solution. The thermal interface pad can have a star shape, and a pressure is applied to at least one of the two components. The pressure can cause the star shape thermal interface to expand into a rectangular shape. The expanded rectangular shape does not expand into keep out area positioned around an electronic component of the two components.
Des aspects de la présente invention concernent un procédé d'assemblage qui comprend le couplage thermique de deux composants. Le procédé consiste à fournir un plot d'interface thermique entre les deux composants, tels qu'un circuit intégré et une solution de refroidissement. Le plot d'interface thermique peut avoir une forme d'étoile, et une pression est appliquée à au moins l'un des deux composants. La pression peut amener l'interface thermique en forme d'étoile à se dilater en une forme rectangulaire. La forme rectangulaire étendue ne se dilate pas dans une zone de maintien positionnée autour d'un composant électronique des deux composants.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | METHODS OF ELECTRONIC SYSTEM ASSEMBLY WITH THERMAL INTERFACE PAD AND RELATED ASSEMBLIES |
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