BHM IN ADHESIVE COMPOSITIONS

An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentrat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHAI, Zheng, EBERT, Jefferson Thomas
Format: Patent
Sprache:eng ; fre
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CHAI, Zheng
EBERT, Jefferson Thomas
description An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentration and the adhesive composition demonstrates a sag resistance ranging from 10 mm to 300 mm. L'invention concerne une composition adhésive comprenant une première partie comprenant une résine époxy et une seconde partie comprenant un emballage d'amine multifonctionnel. L'emballage d'amine multifonctionnel comprend de la bis(hexaméthylène)triamine et un synergiste. La concentration en amine est d'au moins 10 % inférieure à la concentration en résine époxy et la composition adhésive présente une résistance à l'affaissement allant de 10 mm à 300 mm.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2023086555A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2023086555A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2023086555A23</originalsourceid><addsrcrecordid>eNrjZJBx8vBV8PRTcHTxcA32DHNVcPb3DfAP9gzx9PcL5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGxgYWZqampo5GxsSpAgDt-yG7</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>BHM IN ADHESIVE COMPOSITIONS</title><source>esp@cenet</source><creator>CHAI, Zheng ; EBERT, Jefferson Thomas</creator><creatorcontrib>CHAI, Zheng ; EBERT, Jefferson Thomas</creatorcontrib><description>An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentration and the adhesive composition demonstrates a sag resistance ranging from 10 mm to 300 mm. L'invention concerne une composition adhésive comprenant une première partie comprenant une résine époxy et une seconde partie comprenant un emballage d'amine multifonctionnel. L'emballage d'amine multifonctionnel comprend de la bis(hexaméthylène)triamine et un synergiste. La concentration en amine est d'au moins 10 % inférieure à la concentration en résine époxy et la composition adhésive présente une résistance à l'affaissement allant de 10 mm à 300 mm.</description><language>eng ; fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230519&amp;DB=EPODOC&amp;CC=WO&amp;NR=2023086555A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230519&amp;DB=EPODOC&amp;CC=WO&amp;NR=2023086555A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHAI, Zheng</creatorcontrib><creatorcontrib>EBERT, Jefferson Thomas</creatorcontrib><title>BHM IN ADHESIVE COMPOSITIONS</title><description>An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentration and the adhesive composition demonstrates a sag resistance ranging from 10 mm to 300 mm. L'invention concerne une composition adhésive comprenant une première partie comprenant une résine époxy et une seconde partie comprenant un emballage d'amine multifonctionnel. L'emballage d'amine multifonctionnel comprend de la bis(hexaméthylène)triamine et un synergiste. La concentration en amine est d'au moins 10 % inférieure à la concentration en résine époxy et la composition adhésive présente une résistance à l'affaissement allant de 10 mm à 300 mm.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBx8vBV8PRTcHTxcA32DHNVcPb3DfAP9gzx9PcL5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGxgYWZqampo5GxsSpAgDt-yG7</recordid><startdate>20230519</startdate><enddate>20230519</enddate><creator>CHAI, Zheng</creator><creator>EBERT, Jefferson Thomas</creator><scope>EVB</scope></search><sort><creationdate>20230519</creationdate><title>BHM IN ADHESIVE COMPOSITIONS</title><author>CHAI, Zheng ; EBERT, Jefferson Thomas</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023086555A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2023</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHAI, Zheng</creatorcontrib><creatorcontrib>EBERT, Jefferson Thomas</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHAI, Zheng</au><au>EBERT, Jefferson Thomas</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>BHM IN ADHESIVE COMPOSITIONS</title><date>2023-05-19</date><risdate>2023</risdate><abstract>An adhesive composition comprising a first part comprising an epoxy resin and a second part comprising a multifunctional amine package. The multifunctional amine package comprises bis(hexamethylene)triamine and a synergist. The amine concentration is at least 10% less than the epoxy resin concentration and the adhesive composition demonstrates a sag resistance ranging from 10 mm to 300 mm. L'invention concerne une composition adhésive comprenant une première partie comprenant une résine époxy et une seconde partie comprenant un emballage d'amine multifonctionnel. L'emballage d'amine multifonctionnel comprend de la bis(hexaméthylène)triamine et un synergiste. La concentration en amine est d'au moins 10 % inférieure à la concentration en résine époxy et la composition adhésive présente une résistance à l'affaissement allant de 10 mm à 300 mm.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre
recordid cdi_epo_espacenet_WO2023086555A2
source esp@cenet
subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
title BHM IN ADHESIVE COMPOSITIONS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T06%3A25%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHAI,%20Zheng&rft.date=2023-05-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2023086555A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true