A COMPOSITION FOR A DIELECTRIC FILLER, A CHIP-EMBEDDED PRINTED CIRCUIT BOARD, AND A METHOD OF EMBEDDING A CHIP IN A PRINTED CIRCUIT BOARD
A chip-embedded printed circuit board 100 includes a cavity 110 in a printed circuit board, a chip 104 in the cavity of the printed circuit board, and a thixotropic dielectric filler 106 in a gap in the cavity to seal the chip in the printed circuit board. Selon l'invention, une carte de circui...
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| creator | AKYURTLU, Dr. Alkim ARMIENTO, Craig A PIRO, Yuri AREIAS, Christopher R RANASINGHA, Dr. Oshadha KINGSLEY, Edward D LUCE, Andrew M KUNCHO, Dr. Christopher N LAMPORT, Emily |
| description | A chip-embedded printed circuit board 100 includes a cavity 110 in a printed circuit board, a chip 104 in the cavity of the printed circuit board, and a thixotropic dielectric filler 106 in a gap in the cavity to seal the chip in the printed circuit board.
Selon l'invention, une carte de circuit imprimé à puce incorporée 100 comprend une cavité 110 dans une carte de circuit imprimé, une puce 104 dans la cavité de la carte de circuit imprimé, et une charge diélectrique thixotrope 106 dans un espace dans la cavité pour sceller la puce dans la carte de circuit imprimé. |
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Selon l'invention, une carte de circuit imprimé à puce incorporée 100 comprend une cavité 110 dans une carte de circuit imprimé, une puce 104 dans la cavité de la carte de circuit imprimé, et une charge diélectrique thixotrope 106 dans un espace dans la cavité pour sceller la puce dans la carte de circuit imprimé.</description><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230504&DB=EPODOC&CC=WO&NR=2023075918A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230504&DB=EPODOC&CC=WO&NR=2023075918A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AKYURTLU, Dr. Alkim</creatorcontrib><creatorcontrib>ARMIENTO, Craig A</creatorcontrib><creatorcontrib>PIRO, Yuri</creatorcontrib><creatorcontrib>AREIAS, Christopher R</creatorcontrib><creatorcontrib>RANASINGHA, Dr. Oshadha</creatorcontrib><creatorcontrib>KINGSLEY, Edward D</creatorcontrib><creatorcontrib>LUCE, Andrew M</creatorcontrib><creatorcontrib>KUNCHO, Dr. Christopher N</creatorcontrib><creatorcontrib>LAMPORT, Emily</creatorcontrib><title>A COMPOSITION FOR A DIELECTRIC FILLER, A CHIP-EMBEDDED PRINTED CIRCUIT BOARD, AND A METHOD OF EMBEDDING A CHIP IN A PRINTED CIRCUIT BOARD</title><description>A chip-embedded printed circuit board 100 includes a cavity 110 in a printed circuit board, a chip 104 in the cavity of the printed circuit board, and a thixotropic dielectric filler 106 in a gap in the cavity to seal the chip in the printed circuit board.
Selon l'invention, une carte de circuit imprimé à puce incorporée 100 comprend une cavité 110 dans une carte de circuit imprimé, une puce 104 dans la cavité de la carte de circuit imprimé, et une charge diélectrique thixotrope 106 dans un espace dans la cavité pour sceller la puce dans la carte de circuit imprimé.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjL0KwjAUhbs4iPoOF1wt9AdRxzS5sRfa3BAjjqVInEQL9SV8awN2dHD6DofvnHnyFiC5tXwiT2xAswMBirBB6R1J0NQ06DaxlDXZFNsKlUIF1pHxkZKcPJOHioVTUTMqqi36mhWwhq9P5jgdAJmYfo6XyezW38ewmrhI1hq9rNMwPLswDv01PMKru3CRFWW22x7yvcjL_6wPgUo92Q</recordid><startdate>20230504</startdate><enddate>20230504</enddate><creator>AKYURTLU, Dr. Alkim</creator><creator>ARMIENTO, Craig A</creator><creator>PIRO, Yuri</creator><creator>AREIAS, Christopher R</creator><creator>RANASINGHA, Dr. Oshadha</creator><creator>KINGSLEY, Edward D</creator><creator>LUCE, Andrew M</creator><creator>KUNCHO, Dr. Christopher N</creator><creator>LAMPORT, Emily</creator><scope>EVB</scope></search><sort><creationdate>20230504</creationdate><title>A COMPOSITION FOR A DIELECTRIC FILLER, A CHIP-EMBEDDED PRINTED CIRCUIT BOARD, AND A METHOD OF EMBEDDING A CHIP IN A PRINTED CIRCUIT BOARD</title><author>AKYURTLU, Dr. Alkim ; ARMIENTO, Craig A ; PIRO, Yuri ; AREIAS, Christopher R ; RANASINGHA, Dr. Oshadha ; KINGSLEY, Edward D ; LUCE, Andrew M ; KUNCHO, Dr. Christopher N ; LAMPORT, Emily</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023075918A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>AKYURTLU, Dr. Alkim</creatorcontrib><creatorcontrib>ARMIENTO, Craig A</creatorcontrib><creatorcontrib>PIRO, Yuri</creatorcontrib><creatorcontrib>AREIAS, Christopher R</creatorcontrib><creatorcontrib>RANASINGHA, Dr. Oshadha</creatorcontrib><creatorcontrib>KINGSLEY, Edward D</creatorcontrib><creatorcontrib>LUCE, Andrew M</creatorcontrib><creatorcontrib>KUNCHO, Dr. Christopher N</creatorcontrib><creatorcontrib>LAMPORT, Emily</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AKYURTLU, Dr. Alkim</au><au>ARMIENTO, Craig A</au><au>PIRO, Yuri</au><au>AREIAS, Christopher R</au><au>RANASINGHA, Dr. Oshadha</au><au>KINGSLEY, Edward D</au><au>LUCE, Andrew M</au><au>KUNCHO, Dr. Christopher N</au><au>LAMPORT, Emily</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A COMPOSITION FOR A DIELECTRIC FILLER, A CHIP-EMBEDDED PRINTED CIRCUIT BOARD, AND A METHOD OF EMBEDDING A CHIP IN A PRINTED CIRCUIT BOARD</title><date>2023-05-04</date><risdate>2023</risdate><abstract>A chip-embedded printed circuit board 100 includes a cavity 110 in a printed circuit board, a chip 104 in the cavity of the printed circuit board, and a thixotropic dielectric filler 106 in a gap in the cavity to seal the chip in the printed circuit board.
Selon l'invention, une carte de circuit imprimé à puce incorporée 100 comprend une cavité 110 dans une carte de circuit imprimé, une puce 104 dans la cavité de la carte de circuit imprimé, et une charge diélectrique thixotrope 106 dans un espace dans la cavité pour sceller la puce dans la carte de circuit imprimé.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | A COMPOSITION FOR A DIELECTRIC FILLER, A CHIP-EMBEDDED PRINTED CIRCUIT BOARD, AND A METHOD OF EMBEDDING A CHIP IN A PRINTED CIRCUIT BOARD |
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