PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS

PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS

Provided are a printed circuit board, a maintenance method therefor, and a display apparatus. In the printed circuit board, normal pads (300) that are not peeled off or damaged are first pads (310), each first pad (310) and a wire (200) connected to same have an integrated structure and are directly...

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Hauptverfasser: FENG, Tian, TONG, Yuhao, FAN, Zhicheng, XIE, Haihai, HE, Guangchao, ZHANG, Jie, MAO, Qining
Format: Patent
Sprache:chi ; eng ; fre
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator FENG, Tian
TONG, Yuhao
FAN, Zhicheng
XIE, Haihai
HE, Guangchao
ZHANG, Jie
MAO, Qining
description Provided are a printed circuit board, a maintenance method therefor, and a display apparatus. In the printed circuit board, normal pads (300) that are not peeled off or damaged are first pads (310), each first pad (310) and a wire (200) connected to same have an integrated structure and are directly formed on a substrate (100). After a pad (300) at a certain position on the substrate (100) is peeled off, a second pad (320) can be provided at the position where the pad (300) is peeled off, so as to replace the pad (300) that was originally peeled off, and the second pad (320) comes into contact with the wire (200) and is fixed by solder (500), and a second pin (412) of a component (400) overlaps with the second pad (320) and is fixed by the solder (500). Using the second pad (320) to replace the peeled pad (300) for maintenance can avoid replacing the entire printed circuit board, thereby increasing the success rate of maintenance, reducing the production cost, and avoiding material waste. In addition, directl
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2023070580A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2023070580A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2023070580A13</originalsourceid><addsrcrecordid>eNrjZPAMCPL0C3F1UXD2DHIO9QxRcPJ3DHLRUfB1BAn7Ofo5uyr4uoZ4-LsohHi4Brm6-QfpKDj6uSi4eAYH-DhGKjgGBDgGOYaEBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDI2MDcwNTCwNHQ2PiVAEA0U0t3A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS</title><source>esp@cenet</source><creator>FENG, Tian ; TONG, Yuhao ; FAN, Zhicheng ; XIE, Haihai ; HE, Guangchao ; ZHANG, Jie ; MAO, Qining</creator><creatorcontrib>FENG, Tian ; TONG, Yuhao ; FAN, Zhicheng ; XIE, Haihai ; HE, Guangchao ; ZHANG, Jie ; MAO, Qining</creatorcontrib><description>Provided are a printed circuit board, a maintenance method therefor, and a display apparatus. In the printed circuit board, normal pads (300) that are not peeled off or damaged are first pads (310), each first pad (310) and a wire (200) connected to same have an integrated structure and are directly formed on a substrate (100). After a pad (300) at a certain position on the substrate (100) is peeled off, a second pad (320) can be provided at the position where the pad (300) is peeled off, so as to replace the pad (300) that was originally peeled off, and the second pad (320) comes into contact with the wire (200) and is fixed by solder (500), and a second pin (412) of a component (400) overlaps with the second pad (320) and is fixed by the solder (500). Using the second pad (320) to replace the peeled pad (300) for maintenance can avoid replacing the entire printed circuit board, thereby increasing the success rate of maintenance, reducing the production cost, and avoiding material waste. In addition, directl</description><language>chi ; eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230504&amp;DB=EPODOC&amp;CC=WO&amp;NR=2023070580A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230504&amp;DB=EPODOC&amp;CC=WO&amp;NR=2023070580A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FENG, Tian</creatorcontrib><creatorcontrib>TONG, Yuhao</creatorcontrib><creatorcontrib>FAN, Zhicheng</creatorcontrib><creatorcontrib>XIE, Haihai</creatorcontrib><creatorcontrib>HE, Guangchao</creatorcontrib><creatorcontrib>ZHANG, Jie</creatorcontrib><creatorcontrib>MAO, Qining</creatorcontrib><title>PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS</title><description>Provided are a printed circuit board, a maintenance method therefor, and a display apparatus. In the printed circuit board, normal pads (300) that are not peeled off or damaged are first pads (310), each first pad (310) and a wire (200) connected to same have an integrated structure and are directly formed on a substrate (100). After a pad (300) at a certain position on the substrate (100) is peeled off, a second pad (320) can be provided at the position where the pad (300) is peeled off, so as to replace the pad (300) that was originally peeled off, and the second pad (320) comes into contact with the wire (200) and is fixed by solder (500), and a second pin (412) of a component (400) overlaps with the second pad (320) and is fixed by the solder (500). Using the second pad (320) to replace the peeled pad (300) for maintenance can avoid replacing the entire printed circuit board, thereby increasing the success rate of maintenance, reducing the production cost, and avoiding material waste. In addition, directl</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAMCPL0C3F1UXD2DHIO9QxRcPJ3DHLRUfB1BAn7Ofo5uyr4uoZ4-LsohHi4Brm6-QfpKDj6uSi4eAYH-DhGKjgGBDgGOYaEBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvhwfyMDI2MDcwNTCwNHQ2PiVAEA0U0t3A</recordid><startdate>20230504</startdate><enddate>20230504</enddate><creator>FENG, Tian</creator><creator>TONG, Yuhao</creator><creator>FAN, Zhicheng</creator><creator>XIE, Haihai</creator><creator>HE, Guangchao</creator><creator>ZHANG, Jie</creator><creator>MAO, Qining</creator><scope>EVB</scope></search><sort><creationdate>20230504</creationdate><title>PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS</title><author>FENG, Tian ; TONG, Yuhao ; FAN, Zhicheng ; XIE, Haihai ; HE, Guangchao ; ZHANG, Jie ; MAO, Qining</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023070580A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng ; fre</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>FENG, Tian</creatorcontrib><creatorcontrib>TONG, Yuhao</creatorcontrib><creatorcontrib>FAN, Zhicheng</creatorcontrib><creatorcontrib>XIE, Haihai</creatorcontrib><creatorcontrib>HE, Guangchao</creatorcontrib><creatorcontrib>ZHANG, Jie</creatorcontrib><creatorcontrib>MAO, Qining</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FENG, Tian</au><au>TONG, Yuhao</au><au>FAN, Zhicheng</au><au>XIE, Haihai</au><au>HE, Guangchao</au><au>ZHANG, Jie</au><au>MAO, Qining</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS</title><date>2023-05-04</date><risdate>2023</risdate><abstract>Provided are a printed circuit board, a maintenance method therefor, and a display apparatus. In the printed circuit board, normal pads (300) that are not peeled off or damaged are first pads (310), each first pad (310) and a wire (200) connected to same have an integrated structure and are directly formed on a substrate (100). After a pad (300) at a certain position on the substrate (100) is peeled off, a second pad (320) can be provided at the position where the pad (300) is peeled off, so as to replace the pad (300) that was originally peeled off, and the second pad (320) comes into contact with the wire (200) and is fixed by solder (500), and a second pin (412) of a component (400) overlaps with the second pad (320) and is fixed by the solder (500). Using the second pad (320) to replace the peeled pad (300) for maintenance can avoid replacing the entire printed circuit board, thereby increasing the success rate of maintenance, reducing the production cost, and avoiding material waste. In addition, directl</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED CIRCUIT BOARD, MAINTENANCE METHOD THEREFOR, AND DISPLAY APPARATUS
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