INK COMPOSITION FOR OLED PACKAGING AND APPLICATION THEREOF
Provided are an ink composition comprising a POSS structure and an application thereof. The ink composition comprises the following components in percentage by weight: 20-40% of a monomer containing the POSS structure, 50-70% of a photocuring monomer, 1-10% of a photoinitiator; and the monomer conta...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | YANG, Chufeng SHEN, Xin WANG, Shihao HONG, Haibing |
| description | Provided are an ink composition comprising a POSS structure and an application thereof. The ink composition comprises the following components in percentage by weight: 20-40% of a monomer containing the POSS structure, 50-70% of a photocuring monomer, 1-10% of a photoinitiator; and the monomer containing the POSS structure contains a repeating unit as shown in general formula (R-SiO1.5)n, wherein at least one R group is selected from a structure having acryloyloxy or methacryloyloxy. By introducing the POSS structure into the ink composition for OLED packaging, the ink composition has a better packaging effect, and an organic packaging layer prepared from the ink has extremely low water vapor permeability and oxygen permeability, thereby being capable of effectively prolonging the service life of an OLED device. In addition, the ink composition can effectively reduce the preparation cost and the process difficulty of an OLED packaging film by means of the rationalization of a component proportion.
L'invention |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2023065723A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2023065723A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2023065723A13</originalsourceid><addsrcrecordid>eNrjZLDy9PNWcPb3DfAP9gzx9PdTcPMPUvD3cXVRCHB09nZ09_RzV3D0c1FwDAjw8XR2BCsJ8XANcvV342FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGxgZmpuZGxo6GxsSpAgBGXynH</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INK COMPOSITION FOR OLED PACKAGING AND APPLICATION THEREOF</title><source>esp@cenet</source><creator>YANG, Chufeng ; SHEN, Xin ; WANG, Shihao ; HONG, Haibing</creator><creatorcontrib>YANG, Chufeng ; SHEN, Xin ; WANG, Shihao ; HONG, Haibing</creatorcontrib><description>Provided are an ink composition comprising a POSS structure and an application thereof. The ink composition comprises the following components in percentage by weight: 20-40% of a monomer containing the POSS structure, 50-70% of a photocuring monomer, 1-10% of a photoinitiator; and the monomer containing the POSS structure contains a repeating unit as shown in general formula (R-SiO1.5)n, wherein at least one R group is selected from a structure having acryloyloxy or methacryloyloxy. By introducing the POSS structure into the ink composition for OLED packaging, the ink composition has a better packaging effect, and an organic packaging layer prepared from the ink has extremely low water vapor permeability and oxygen permeability, thereby being capable of effectively prolonging the service life of an OLED device. In addition, the ink composition can effectively reduce the preparation cost and the process difficulty of an OLED packaging film by means of the rationalization of a component proportion.
L'invention</description><language>chi ; eng ; fre</language><subject>ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230427&DB=EPODOC&CC=WO&NR=2023065723A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230427&DB=EPODOC&CC=WO&NR=2023065723A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YANG, Chufeng</creatorcontrib><creatorcontrib>SHEN, Xin</creatorcontrib><creatorcontrib>WANG, Shihao</creatorcontrib><creatorcontrib>HONG, Haibing</creatorcontrib><title>INK COMPOSITION FOR OLED PACKAGING AND APPLICATION THEREOF</title><description>Provided are an ink composition comprising a POSS structure and an application thereof. The ink composition comprises the following components in percentage by weight: 20-40% of a monomer containing the POSS structure, 50-70% of a photocuring monomer, 1-10% of a photoinitiator; and the monomer containing the POSS structure contains a repeating unit as shown in general formula (R-SiO1.5)n, wherein at least one R group is selected from a structure having acryloyloxy or methacryloyloxy. By introducing the POSS structure into the ink composition for OLED packaging, the ink composition has a better packaging effect, and an organic packaging layer prepared from the ink has extremely low water vapor permeability and oxygen permeability, thereby being capable of effectively prolonging the service life of an OLED device. In addition, the ink composition can effectively reduce the preparation cost and the process difficulty of an OLED packaging film by means of the rationalization of a component proportion.
L'invention</description><subject>ADHESIVES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDy9PNWcPb3DfAP9gzx9PdTcPMPUvD3cXVRCHB09nZ09_RzV3D0c1FwDAjw8XR2BCsJ8XANcvV342FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGxgZmpuZGxo6GxsSpAgBGXynH</recordid><startdate>20230427</startdate><enddate>20230427</enddate><creator>YANG, Chufeng</creator><creator>SHEN, Xin</creator><creator>WANG, Shihao</creator><creator>HONG, Haibing</creator><scope>EVB</scope></search><sort><creationdate>20230427</creationdate><title>INK COMPOSITION FOR OLED PACKAGING AND APPLICATION THEREOF</title><author>YANG, Chufeng ; SHEN, Xin ; WANG, Shihao ; HONG, Haibing</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023065723A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng ; fre</language><creationdate>2023</creationdate><topic>ADHESIVES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>YANG, Chufeng</creatorcontrib><creatorcontrib>SHEN, Xin</creatorcontrib><creatorcontrib>WANG, Shihao</creatorcontrib><creatorcontrib>HONG, Haibing</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YANG, Chufeng</au><au>SHEN, Xin</au><au>WANG, Shihao</au><au>HONG, Haibing</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INK COMPOSITION FOR OLED PACKAGING AND APPLICATION THEREOF</title><date>2023-04-27</date><risdate>2023</risdate><abstract>Provided are an ink composition comprising a POSS structure and an application thereof. The ink composition comprises the following components in percentage by weight: 20-40% of a monomer containing the POSS structure, 50-70% of a photocuring monomer, 1-10% of a photoinitiator; and the monomer containing the POSS structure contains a repeating unit as shown in general formula (R-SiO1.5)n, wherein at least one R group is selected from a structure having acryloyloxy or methacryloyloxy. By introducing the POSS structure into the ink composition for OLED packaging, the ink composition has a better packaging effect, and an organic packaging layer prepared from the ink has extremely low water vapor permeability and oxygen permeability, thereby being capable of effectively prolonging the service life of an OLED device. In addition, the ink composition can effectively reduce the preparation cost and the process difficulty of an OLED packaging film by means of the rationalization of a component proportion.
L'invention</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng ; fre |
| recordid | cdi_epo_espacenet_WO2023065723A1 |
| source | esp@cenet |
| subjects | ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | INK COMPOSITION FOR OLED PACKAGING AND APPLICATION THEREOF |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T16%3A45%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YANG,%20Chufeng&rft.date=2023-04-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2023065723A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |