HEAT DISSIPATION DEVICE, HEAT DISSIPATION STRUCTURE PARAMETER DETERMINATION METHOD AND APPARATUS, DEVICE, AND MEDIUM

Disclosed are a heat dissipation device, a heat dissipation structure parameter determination method and apparatus, a device, and a medium. The heat dissipation device is disposed inside a housing of an electronic device, and comprises a heat-conducting casing and at least one heat dissipation fin....

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Bibliographische Detailangaben
Hauptverfasser:	ZHANG, Fengchun, CHEN, Zhihui, LI, Qiushuang, WEI, Qiang, SU, Haichao, HAO, Weifeng, ZHANG, Yong
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Disclosed are a heat dissipation device, a heat dissipation structure parameter determination method and apparatus, a device, and a medium. The heat dissipation device is disposed inside a housing of an electronic device, and comprises a heat-conducting casing and at least one heat dissipation fin. The heat-conducting casing comprises a heat dissipation surface and a heat-absorbing surface. The side of the heat-conducting casing close to the housing is the heat dissipation surface. The heat dissipation surface is configured to fix at least one heat dissipation fin and transfer heat to the at least one heat dissipation fin and to the external environment. The side of the heat-conducting casing away from the housing is the heat-absorbing surface. The heat-absorbing surface is configured to fix a target heat dissipation device of the electronic device and transfer heat from the target heat dissipation device. At least one heat dissipation fin is fixed on the heat dissipation surface according to heat dissipation