LASER PROCESSING DEVICE AND LASER PROCESSING METHOD

A laser head (10) emits laser light. A liquid tank (1) has containers (1F, 1S, 1T) divided from each other so as to enable a transmission-inhibiting liquid (LI) to be stored separately therein. Each of the containers (1F, 1S, 1T) can support a workpiece (WO1, WO2, WO3) to be processed by the laser h...

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Hauptverfasser:	YAMAGUCHI, Yoshihiro, NOZAKI, Shigeru, TAKATA, Nobuhiro
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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creator	YAMAGUCHI, Yoshihiro NOZAKI, Shigeru TAKATA, Nobuhiro
description	A laser head (10) emits laser light. A liquid tank (1) has containers (1F, 1S, 1T) divided from each other so as to enable a transmission-inhibiting liquid (LI) to be stored separately therein. Each of the containers (1F, 1S, 1T) can support a workpiece (WO1, WO2, WO3) to be processed by the laser head (10). Each of the containers (1F, 1S, 1T) individually has a liquid level adjustment mechanism (47), and the liquid level of the transmission-inhibiting liquid (LI) in each of the containers (1F, 1S, 1T) is independently adjusted. Une tête laser (10) émet une lumière laser. Un réservoir de liquide (1) comprend des conteneurs (1F, 1S, 1T) divisés les uns par rapport aux autres de façon à permettre à un liquide d'inhibition de transmission (LI) d'être stocké séparément à l'intérieur de ceux-ci. Chacun des conteneurs (1F, 1S, 1T) peut supporter une pièce à travailler (WO1, WO2, WO3) devant être traitée par la tête laser (10). Chacun des conteneurs (1F, 1S, 1T) comporte individuellement un mécanisme de réglage de niveau de liquide (47), et le niveau de liquide du liquide d'inhibition de transmission (LI) dans chacun des conteneurs (1F, 1S, 1T) est ajusté indépendamment. レーザヘッド（１０）は、レーザ光を射出する。液槽（１）は、個別に透過抑制液（ＬＩ）を貯留可能なように互いに分けられた容器（１Ｆ、１Ｓ、１Ｔ）を有する。容器（１Ｆ、１Ｓ、１Ｔ）の各々は、レーザヘッド（１０）により加工される被加工材（ＷＯ１、ＷＯ２、ＷＯ３）を支持可能である。容器（１Ｆ、１Ｓ、１Ｔ）の各々は個別に液位調整機構（４７）を有し、容器（１Ｆ、１Ｓ、１Ｔ）の各々における透過抑制液（ＬＩ）の液位は独立に調整される。
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A liquid tank (1) has containers (1F, 1S, 1T) divided from each other so as to enable a transmission-inhibiting liquid (LI) to be stored separately therein. Each of the containers (1F, 1S, 1T) can support a workpiece (WO1, WO2, WO3) to be processed by the laser head (10). Each of the containers (1F, 1S, 1T) individually has a liquid level adjustment mechanism (47), and the liquid level of the transmission-inhibiting liquid (LI) in each of the containers (1F, 1S, 1T) is independently adjusted. Une tête laser (10) émet une lumière laser. Un réservoir de liquide (1) comprend des conteneurs (1F, 1S, 1T) divisés les uns par rapport aux autres de façon à permettre à un liquide d'inhibition de transmission (LI) d'être stocké séparément à l'intérieur de ceux-ci. Chacun des conteneurs (1F, 1S, 1T) peut supporter une pièce à travailler (WO1, WO2, WO3) devant être traitée par la tête laser (10). Chacun des conteneurs (1F, 1S, 1T) comporte individuellement un mécanisme de réglage de niveau de liquide (47), et le niveau de liquide du liquide d'inhibition de transmission (LI) dans chacun des conteneurs (1F, 1S, 1T) est ajusté indépendamment. レーザヘッド（１０）は、レーザ光を射出する。液槽（１）は、個別に透過抑制液（ＬＩ）を貯留可能なように互いに分けられた容器（１Ｆ、１Ｓ、１Ｔ）を有する。容器（１Ｆ、１Ｓ、１Ｔ）の各々は、レーザヘッド（１０）により加工される被加工材（ＷＯ１、ＷＯ２、ＷＯ３）を支持可能である。容器（１Ｆ、１Ｓ、１Ｔ）の各々は個別に液位調整機構（４７）を有し、容器（１Ｆ、１Ｓ、１Ｔ）の各々における透過抑制液（ＬＩ）の液位は独立に調整される。</description><language>eng ; fre ; jpn</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230330&DB=EPODOC&CC=WO&NR=2023047813A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25553,76306</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230330&DB=EPODOC&CC=WO&NR=2023047813A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMAGUCHI, Yoshihiro</creatorcontrib><creatorcontrib>NOZAKI, Shigeru</creatorcontrib><creatorcontrib>TAKATA, Nobuhiro</creatorcontrib><title>LASER PROCESSING DEVICE AND LASER PROCESSING METHOD</title><description>A laser head (10) emits laser light. A liquid tank (1) has containers (1F, 1S, 1T) divided from each other so as to enable a transmission-inhibiting liquid (LI) to be stored separately therein. Each of the containers (1F, 1S, 1T) can support a workpiece (WO1, WO2, WO3) to be processed by the laser head (10). Each of the containers (1F, 1S, 1T) individually has a liquid level adjustment mechanism (47), and the liquid level of the transmission-inhibiting liquid (LI) in each of the containers (1F, 1S, 1T) is independently adjusted. Une tête laser (10) émet une lumière laser. Un réservoir de liquide (1) comprend des conteneurs (1F, 1S, 1T) divisés les uns par rapport aux autres de façon à permettre à un liquide d'inhibition de transmission (LI) d'être stocké séparément à l'intérieur de ceux-ci. Chacun des conteneurs (1F, 1S, 1T) peut supporter une pièce à travailler (WO1, WO2, WO3) devant être traitée par la tête laser (10). Chacun des conteneurs (1F, 1S, 1T) comporte individuellement un mécanisme de réglage de niveau de liquide (47), et le niveau de liquide du liquide d'inhibition de transmission (LI) dans chacun des conteneurs (1F, 1S, 1T) est ajusté indépendamment. レーザヘッド（１０）は、レーザ光を射出する。液槽（１）は、個別に透過抑制液（ＬＩ）を貯留可能なように互いに分けられた容器（１Ｆ、１Ｓ、１Ｔ）を有する。容器（１Ｆ、１Ｓ、１Ｔ）の各々は、レーザヘッド（１０）により加工される被加工材（ＷＯ１、ＷＯ２、ＷＯ３）を支持可能である。容器（１Ｆ、１Ｓ、１Ｔ）の各々は個別に液位調整機構（４７）を有し、容器（１Ｆ、１Ｓ、１Ｔ）の各々における透過抑制液（ＬＩ）の液位は独立に調整される。</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDD2cQx2DVIICPJ3dg0O9vRzV3BxDfN0dlVw9HNRwJDzdQ3x8HfhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkbGBibmFobGjobGxKkCADRAJ_I</recordid><startdate>20230330</startdate><enddate>20230330</enddate><creator>YAMAGUCHI, Yoshihiro</creator><creator>NOZAKI, Shigeru</creator><creator>TAKATA, Nobuhiro</creator><scope>EVB</scope></search><sort><creationdate>20230330</creationdate><title>LASER PROCESSING DEVICE AND LASER PROCESSING METHOD</title><author>YAMAGUCHI, Yoshihiro ; NOZAKI, Shigeru ; TAKATA, Nobuhiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023047813A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2023</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAGUCHI, Yoshihiro</creatorcontrib><creatorcontrib>NOZAKI, Shigeru</creatorcontrib><creatorcontrib>TAKATA, Nobuhiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMAGUCHI, Yoshihiro</au><au>NOZAKI, Shigeru</au><au>TAKATA, Nobuhiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING DEVICE AND LASER PROCESSING METHOD</title><date>2023-03-30</date><risdate>2023</risdate><abstract>A laser head (10) emits laser light. A liquid tank (1) has containers (1F, 1S, 1T) divided from each other so as to enable a transmission-inhibiting liquid (LI) to be stored separately therein. Each of the containers (1F, 1S, 1T) can support a workpiece (WO1, WO2, WO3) to be processed by the laser head (10). Each of the containers (1F, 1S, 1T) individually has a liquid level adjustment mechanism (47), and the liquid level of the transmission-inhibiting liquid (LI) in each of the containers (1F, 1S, 1T) is independently adjusted. Une tête laser (10) émet une lumière laser. Un réservoir de liquide (1) comprend des conteneurs (1F, 1S, 1T) divisés les uns par rapport aux autres de façon à permettre à un liquide d'inhibition de transmission (LI) d'être stocké séparément à l'intérieur de ceux-ci. Chacun des conteneurs (1F, 1S, 1T) peut supporter une pièce à travailler (WO1, WO2, WO3) devant être traitée par la tête laser (10). Chacun des conteneurs (1F, 1S, 1T) comporte individuellement un mécanisme de réglage de niveau de liquide (47), et le niveau de liquide du liquide d'inhibition de transmission (LI) dans chacun des conteneurs (1F, 1S, 1T) est ajusté indépendamment. レーザヘッド（１０）は、レーザ光を射出する。液槽（１）は、個別に透過抑制液（ＬＩ）を貯留可能なように互いに分けられた容器（１Ｆ、１Ｓ、１Ｔ）を有する。容器（１Ｆ、１Ｓ、１Ｔ）の各々は、レーザヘッド（１０）により加工される被加工材（ＷＯ１、ＷＯ２、ＷＯ３）を支持可能である。容器（１Ｆ、１Ｓ、１Ｔ）の各々は個別に液位調整機構（４７）を有し、容器（１Ｆ、１Ｓ、１Ｔ）の各々における透過抑制液（ＬＩ）の液位は独立に調整される。</abstract><oa>free_for_read</oa></addata></record>
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subjects	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	LASER PROCESSING DEVICE AND LASER PROCESSING METHOD
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