OPTICAL MODULE

An optical module (200), comprising: an upper housing (201), a lower housing (202), a circuit board (300), and optical transceiving sub-modules (400, 500). The lower housing (202) and the upper housing (201) are closed to form a wrapping cavity, and the circuit board (300) is disposed in the interio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHU, Yantao, SI, Baofeng, XU, Fabu, CHI, Yaxun, CHEN, Jinlei
Format: Patent
Sprache:chi ; eng ; fre
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ZHU, Yantao
SI, Baofeng
XU, Fabu
CHI, Yaxun
CHEN, Jinlei
description An optical module (200), comprising: an upper housing (201), a lower housing (202), a circuit board (300), and optical transceiving sub-modules (400, 500). The lower housing (202) and the upper housing (201) are closed to form a wrapping cavity, and the circuit board (300) is disposed in the interior of the wrapping cavity. The lower housing (202) comprises a cover plate (2013) and a first upper side plate (2011) and a second upper side plate (2012) that are disposed on two sides of the cover plate (2013; and the upper housing (201) comprises a bottom plate (2023) and a first lower side plate (2021) and a second lower side plate (2022) that are disposed on two sides of the bottom plate (2023). The optical transceiving sub-modules (400, 500) are disposed in the interior of the wrapping cavity and are connected to one end of the circuit board (300). An inner wall of the bottom plate (2023) is provided with a first shielding baffle group (206), and an inner wall of the cover plate (2013) is provided with a secon
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2023045290A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2023045290A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2023045290A13</originalsourceid><addsrcrecordid>eNrjZODzDwjxdHb0UfD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGRsYGJqZGlgaOhsbEqQIAOXUdzQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OPTICAL MODULE</title><source>esp@cenet</source><creator>ZHU, Yantao ; SI, Baofeng ; XU, Fabu ; CHI, Yaxun ; CHEN, Jinlei</creator><creatorcontrib>ZHU, Yantao ; SI, Baofeng ; XU, Fabu ; CHI, Yaxun ; CHEN, Jinlei</creatorcontrib><description>An optical module (200), comprising: an upper housing (201), a lower housing (202), a circuit board (300), and optical transceiving sub-modules (400, 500). The lower housing (202) and the upper housing (201) are closed to form a wrapping cavity, and the circuit board (300) is disposed in the interior of the wrapping cavity. The lower housing (202) comprises a cover plate (2013) and a first upper side plate (2011) and a second upper side plate (2012) that are disposed on two sides of the cover plate (2013; and the upper housing (201) comprises a bottom plate (2023) and a first lower side plate (2021) and a second lower side plate (2022) that are disposed on two sides of the bottom plate (2023). The optical transceiving sub-modules (400, 500) are disposed in the interior of the wrapping cavity and are connected to one end of the circuit board (300). An inner wall of the bottom plate (2023) is provided with a first shielding baffle group (206), and an inner wall of the cover plate (2013) is provided with a secon</description><language>chi ; eng ; fre</language><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230330&amp;DB=EPODOC&amp;CC=WO&amp;NR=2023045290A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230330&amp;DB=EPODOC&amp;CC=WO&amp;NR=2023045290A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHU, Yantao</creatorcontrib><creatorcontrib>SI, Baofeng</creatorcontrib><creatorcontrib>XU, Fabu</creatorcontrib><creatorcontrib>CHI, Yaxun</creatorcontrib><creatorcontrib>CHEN, Jinlei</creatorcontrib><title>OPTICAL MODULE</title><description>An optical module (200), comprising: an upper housing (201), a lower housing (202), a circuit board (300), and optical transceiving sub-modules (400, 500). The lower housing (202) and the upper housing (201) are closed to form a wrapping cavity, and the circuit board (300) is disposed in the interior of the wrapping cavity. The lower housing (202) comprises a cover plate (2013) and a first upper side plate (2011) and a second upper side plate (2012) that are disposed on two sides of the cover plate (2013; and the upper housing (201) comprises a bottom plate (2023) and a first lower side plate (2021) and a second lower side plate (2022) that are disposed on two sides of the bottom plate (2023). The optical transceiving sub-modules (400, 500) are disposed in the interior of the wrapping cavity and are connected to one end of the circuit board (300). An inner wall of the bottom plate (2023) is provided with a first shielding baffle group (206), and an inner wall of the cover plate (2013) is provided with a secon</description><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODzDwjxdHb0UfD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGRsYGJqZGlgaOhsbEqQIAOXUdzQ</recordid><startdate>20230330</startdate><enddate>20230330</enddate><creator>ZHU, Yantao</creator><creator>SI, Baofeng</creator><creator>XU, Fabu</creator><creator>CHI, Yaxun</creator><creator>CHEN, Jinlei</creator><scope>EVB</scope></search><sort><creationdate>20230330</creationdate><title>OPTICAL MODULE</title><author>ZHU, Yantao ; SI, Baofeng ; XU, Fabu ; CHI, Yaxun ; CHEN, Jinlei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023045290A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng ; fre</language><creationdate>2023</creationdate><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHU, Yantao</creatorcontrib><creatorcontrib>SI, Baofeng</creatorcontrib><creatorcontrib>XU, Fabu</creatorcontrib><creatorcontrib>CHI, Yaxun</creatorcontrib><creatorcontrib>CHEN, Jinlei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHU, Yantao</au><au>SI, Baofeng</au><au>XU, Fabu</au><au>CHI, Yaxun</au><au>CHEN, Jinlei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL MODULE</title><date>2023-03-30</date><risdate>2023</risdate><abstract>An optical module (200), comprising: an upper housing (201), a lower housing (202), a circuit board (300), and optical transceiving sub-modules (400, 500). The lower housing (202) and the upper housing (201) are closed to form a wrapping cavity, and the circuit board (300) is disposed in the interior of the wrapping cavity. The lower housing (202) comprises a cover plate (2013) and a first upper side plate (2011) and a second upper side plate (2012) that are disposed on two sides of the cover plate (2013; and the upper housing (201) comprises a bottom plate (2023) and a first lower side plate (2021) and a second lower side plate (2022) that are disposed on two sides of the bottom plate (2023). The optical transceiving sub-modules (400, 500) are disposed in the interior of the wrapping cavity and are connected to one end of the circuit board (300). An inner wall of the bottom plate (2023) is provided with a first shielding baffle group (206), and an inner wall of the cover plate (2013) is provided with a secon</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng ; fre
recordid cdi_epo_espacenet_WO2023045290A1
source esp@cenet
subjects OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
title OPTICAL MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-04T21%3A57%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ZHU,%20Yantao&rft.date=2023-03-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2023045290A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true