MULTILAYER SUBSTRATE

A first interlayer connection conductor penetrates through resin layers in a lamination direction, and electrically connects a first signal conductor and a second signal conductor. A second interlayer connection conductor penetrates through the resin layers in the lamination direction, and electrica...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJII Hirotaka, TERANISHI Keisuke
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES
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