PREDICTION METHOD, PREDICTION PROGRAM, PREDICTION DEVICE, LEARNING METHOD, LEARNING PROGRAM, AND LEARNING DEVICE
This prediction method predicts an etching rate for an input condition, which has been input, by using a model that outputs the etching rate on the basis of feature amounts pertaining to a film and a chemical liquid in the etching of a substrate. In addition, the prediction method provides the predi...
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creator | NAKAMORI, Mitsunori HIGUCHI, Rintaro |
description | This prediction method predicts an etching rate for an input condition, which has been input, by using a model that outputs the etching rate on the basis of feature amounts pertaining to a film and a chemical liquid in the etching of a substrate. In addition, the prediction method provides the predicted etching rate.
Le procédé de prédiction selon l'invention prédit un taux de gravure lié à un état d'entrée ayant été introduit, en utilisant un modèle qui produit le taux de gravure sur la base de quantités caractéristiques se rapportant à un film et à un liquide chimique dans la gravure d'un substrat. De plus, le procédé de prédiction fournit la vitesse de gravure prédite.
予測方法は、基板のエッチングにおける膜及び薬液に関する特徴量を基にエッチングレートを出力するモデルを用いて、入力された入力条件に対するエッチングレートを予測する。また、予測方法は、予測したエッチングレートを提供する。 |
format | Patent |
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Le procédé de prédiction selon l'invention prédit un taux de gravure lié à un état d'entrée ayant été introduit, en utilisant un modèle qui produit le taux de gravure sur la base de quantités caractéristiques se rapportant à un film et à un liquide chimique dans la gravure d'un substrat. De plus, le procédé de prédiction fournit la vitesse de gravure prédite.
予測方法は、基板のエッチングにおける膜及び薬液に関する特徴量を基にエッチングレートを出力するモデルを用いて、入力された入力条件に対するエッチングレートを予測する。また、予測方法は、予測したエッチングレートを提供する。</description><language>eng ; fre ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS ; COMPUTING ; COUNTING ; DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PHYSICS ; SEMICONDUCTOR DEVICES ; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=WO&NR=2023013436A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,782,887,25571,76555</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230209&DB=EPODOC&CC=WO&NR=2023013436A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAMORI, Mitsunori</creatorcontrib><creatorcontrib>HIGUCHI, Rintaro</creatorcontrib><title>PREDICTION METHOD, PREDICTION PROGRAM, PREDICTION DEVICE, LEARNING METHOD, LEARNING PROGRAM, AND LEARNING DEVICE</title><description>This prediction method predicts an etching rate for an input condition, which has been input, by using a model that outputs the etching rate on the basis of feature amounts pertaining to a film and a chemical liquid in the etching of a substrate. In addition, the prediction method provides the predicted etching rate.
Le procédé de prédiction selon l'invention prédit un taux de gravure lié à un état d'entrée ayant été introduit, en utilisant un modèle qui produit le taux de gravure sur la base de quantités caractéristiques se rapportant à un film et à un liquide chimique dans la gravure d'un substrat. De plus, le procédé de prédiction fournit la vitesse de gravure prédite.
予測方法は、基板のエッチングにおける膜及び薬液に関する特徴量を基にエッチングレートを出力するモデルを用いて、入力された入力条件に対するエッチングレートを予測する。また、予測方法は、予測したエッチングレートを提供する。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCgICHJ18XQO8fT3U_B1DfHwd9FRQBIKCPJ3D3L0RRFzcQ3zdHbVUfBxdQzy8_Rzh-uDC8B1Ofq5IEQh-ngYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXy4v5GBkbGBobGJsZmjoTFxqgCCrjg7</recordid><startdate>20230209</startdate><enddate>20230209</enddate><creator>NAKAMORI, Mitsunori</creator><creator>HIGUCHI, Rintaro</creator><scope>EVB</scope></search><sort><creationdate>20230209</creationdate><title>PREDICTION METHOD, PREDICTION PROGRAM, PREDICTION DEVICE, LEARNING METHOD, LEARNING PROGRAM, AND LEARNING DEVICE</title><author>NAKAMORI, Mitsunori ; HIGUCHI, Rintaro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023013436A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAMORI, Mitsunori</creatorcontrib><creatorcontrib>HIGUCHI, Rintaro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAMORI, Mitsunori</au><au>HIGUCHI, Rintaro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PREDICTION METHOD, PREDICTION PROGRAM, PREDICTION DEVICE, LEARNING METHOD, LEARNING PROGRAM, AND LEARNING DEVICE</title><date>2023-02-09</date><risdate>2023</risdate><abstract>This prediction method predicts an etching rate for an input condition, which has been input, by using a model that outputs the etching rate on the basis of feature amounts pertaining to a film and a chemical liquid in the etching of a substrate. In addition, the prediction method provides the predicted etching rate.
Le procédé de prédiction selon l'invention prédit un taux de gravure lié à un état d'entrée ayant été introduit, en utilisant un modèle qui produit le taux de gravure sur la base de quantités caractéristiques se rapportant à un film et à un liquide chimique dans la gravure d'un substrat. De plus, le procédé de prédiction fournit la vitesse de gravure prédite.
予測方法は、基板のエッチングにおける膜及び薬液に関する特徴量を基にエッチングレートを出力するモデルを用いて、入力された入力条件に対するエッチングレートを予測する。また、予測方法は、予測したエッチングレートを提供する。</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING DATA PROCESSING SYSTEMS OR METHODS, SPECIALLY ADAPTED FORADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORYOR FORECASTING PURPOSES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE,COMMERCIAL, FINANCIAL, MANAGERIAL, SUPERVISORY OR FORECASTINGPURPOSES, NOT OTHERWISE PROVIDED FOR |
title | PREDICTION METHOD, PREDICTION PROGRAM, PREDICTION DEVICE, LEARNING METHOD, LEARNING PROGRAM, AND LEARNING DEVICE |
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