SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS
A method of manufacturing a printed wiring assembly "PWA" on a substrate, is provided herein. The method includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the d...
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| creator | RONEN, Aviv Mordechai NAIGERTSIK, Oleg |
| description | A method of manufacturing a printed wiring assembly "PWA" on a substrate, is provided herein. The method includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.
L'invention concerne un procédé de fabrication d'un ensemble de câblage imprimé "PWA" sur un substrat. Le procédé comprend les étapes suivantes : la reception des données d'assemblage associées audit PWA ; la distribution, sur ledit substrat, et en fonction des données d'assemblage, d'une encre conductrice ; le durcissement de l'encre conductrice distribuée ; la réduction, par traitement au plasma, de l'encre conductrice durcie ; le dépôt d'un matériau de brasure au-dessus d'au moins une partie de l'encre conductrice réduite ; la saisie et la mise en place, en fonction des données d'assemblage, d'un ou plusieurs composants sur le matériau de brasure déposé ; et la réalisation d'un brasage par refusion, par chauffage, du matériau de brasure déposé, du ou des composants placés, et de l'encre conductrice réduite, formant un composé intermétallique entre ceux-ci. |
| format | Patent |
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L'invention concerne un procédé de fabrication d'un ensemble de câblage imprimé "PWA" sur un substrat. Le procédé comprend les étapes suivantes : la reception des données d'assemblage associées audit PWA ; la distribution, sur ledit substrat, et en fonction des données d'assemblage, d'une encre conductrice ; le durcissement de l'encre conductrice distribuée ; la réduction, par traitement au plasma, de l'encre conductrice durcie ; le dépôt d'un matériau de brasure au-dessus d'au moins une partie de l'encre conductrice réduite ; la saisie et la mise en place, en fonction des données d'assemblage, d'un ou plusieurs composants sur le matériau de brasure déposé ; et la réalisation d'un brasage par refusion, par chauffage, du matériau de brasure déposé, du ou des composants placés, et de l'encre conductrice réduite, formant un composé intermétallique entre ceux-ci.</description><language>eng ; fre</language><subject>ADDITIVE MANUFACTURING TECHNOLOGY ; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=WO&NR=2023002483A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230126&DB=EPODOC&CC=WO&NR=2023002483A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RONEN, Aviv Mordechai</creatorcontrib><creatorcontrib>NAIGERTSIK, Oleg</creatorcontrib><title>SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS</title><description>A method of manufacturing a printed wiring assembly "PWA" on a substrate, is provided herein. The method includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.
L'invention concerne un procédé de fabrication d'un ensemble de câblage imprimé "PWA" sur un substrat. Le procédé comprend les étapes suivantes : la reception des données d'assemblage associées audit PWA ; la distribution, sur ledit substrat, et en fonction des données d'assemblage, d'une encre conductrice ; le durcissement de l'encre conductrice distribuée ; la réduction, par traitement au plasma, de l'encre conductrice durcie ; le dépôt d'un matériau de brasure au-dessus d'au moins une partie de l'encre conductrice réduite ; la saisie et la mise en place, en fonction des données d'assemblage, d'un ou plusieurs composants sur le matériau de brasure déposé ; et la réalisation d'un brasage par refusion, par chauffage, du matériau de brasure déposé, du ou des composants placés, et de l'encre conductrice réduite, formant un composé intermétallique entre ceux-ci.</description><subject>ADDITIVE MANUFACTURING TECHNOLOGY</subject><subject>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLANjgwOcfUNVnD0c1HwdQ3x8HcJVnDzD1JwdHHxDPEMc1XwdfQLdXN0DgkN8vRzV_B3U3D1cXUOCfL383QO5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGxgYGRiYWxo6GxsSpAgDl1yrY</recordid><startdate>20230126</startdate><enddate>20230126</enddate><creator>RONEN, Aviv Mordechai</creator><creator>NAIGERTSIK, Oleg</creator><scope>EVB</scope></search><sort><creationdate>20230126</creationdate><title>SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS</title><author>RONEN, Aviv Mordechai ; NAIGERTSIK, Oleg</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2023002483A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2023</creationdate><topic>ADDITIVE MANUFACTURING TECHNOLOGY</topic><topic>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>RONEN, Aviv Mordechai</creatorcontrib><creatorcontrib>NAIGERTSIK, Oleg</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RONEN, Aviv Mordechai</au><au>NAIGERTSIK, Oleg</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS</title><date>2023-01-26</date><risdate>2023</risdate><abstract>A method of manufacturing a printed wiring assembly "PWA" on a substrate, is provided herein. The method includes the following steps: receiving assembly data associated with said PWA; dispensing, onto said substrate, and in accordance with the assembly data, a conductive ink; curing the dispensed conductive ink; reducing, by plasma treatment, the cured conductive ink; depositing a solder material on top of at least a portion of the reduced conductive ink; picking and placing, in accordance with the assembly data, one or more components on the deposited solder material; and performing reflow soldering, by heating, of the deposited solder material, the one or more placed components, and the reduced conductive ink, forming an intermetallic compound therebetween.
L'invention concerne un procédé de fabrication d'un ensemble de câblage imprimé "PWA" sur un substrat. Le procédé comprend les étapes suivantes : la reception des données d'assemblage associées audit PWA ; la distribution, sur ledit substrat, et en fonction des données d'assemblage, d'une encre conductrice ; le durcissement de l'encre conductrice distribuée ; la réduction, par traitement au plasma, de l'encre conductrice durcie ; le dépôt d'un matériau de brasure au-dessus d'au moins une partie de l'encre conductrice réduite ; la saisie et la mise en place, en fonction des données d'assemblage, d'un ou plusieurs composants sur le matériau de brasure déposé ; et la réalisation d'un brasage par refusion, par chauffage, du matériau de brasure déposé, du ou des composants placés, et de l'encre conductrice réduite, formant un composé intermétallique entre ceux-ci.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | SYSTEMS AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTRONICS |
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