MASK BLANK, REFLECTIVE MASK, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES

Provided is a mask blank comprising a thin film having a sufficiently fast etching rate. The mask blank comprises a multilayer reflective film (2) and a pattern-forming thin film (4) in this order on the main surface of a substrate. The thin film (4) contains tantalum, molybdenum, and nitrogen, and...

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Hauptverfasser: ONO, Takuro, IKEBE, Yohei
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IKEBE, Yohei
description Provided is a mask blank comprising a thin film having a sufficiently fast etching rate. The mask blank comprises a multilayer reflective film (2) and a pattern-forming thin film (4) in this order on the main surface of a substrate. The thin film (4) contains tantalum, molybdenum, and nitrogen, and the ratio of the nitrogen content [atom%] to the total content [atom%] of the tantalum and molybdenum in the thin film (4) is at least 0.15. L'invention concerne une ébauche de masque comprenant un film mince ayant une vitesse de gravure suffisamment rapide. L'ébauche de masque comprend un film réfléchissant multicouche (2) et un film mince de formation de motif (4) disposés dans cet ordre sur la surface principale d'un substrat. Le film mince (4) contient du tantale, du molybdène et de l'azote, et le rapport de la teneur en azote [en pourcentage atomique] à la teneur totale [en pourcentage atomique] du tantale et du molybdène dans le film mince (4) est d'au moins 0,15. エッチング速度が十分に速い薄膜を備えたマスクブランクを提供する。 基板の主表面上に、多層反射膜(2)及びパターン形成用の薄膜(4)をこの順に備えるマスクブランクであって、前記薄膜(4)は、タンタル、モリブデン、および窒素を含み、前記薄膜(4)のタンタルとモリブデンの合計含有量[原子%]に対する窒素含有量[原子%]の比率は、0.15以上である。
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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title MASK BLANK, REFLECTIVE MASK, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES
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