CHEMICAL MECHANICAL POLISHING SLURRY BUILDUP MONITORING
An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled...
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| creator | LI, Thomas Ho Fai |
| description | An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.
Sont divulgués un appareil et un procédé de surveillance de l'accumulation de boue. Un appareil de polissage de substrat comprend une surface revêtue au moins en partie d'un matériau fluorescent, d'une source de lumière conçue pour éclairer la surface, d'un capteur d'image conçu pour imager la surface, et d'un processeur accouplé au capteur d'image et conçu pour surveiller l'accumulation de boue sur la surface au moyen de données fournies par le capteur d'image. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2022216554A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2022216554A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2022216554A13</originalsourceid><addsrcrecordid>eNrjZDB39nD19XR29FHwdXX2cPQDMwP8fTyDPTz93BWCfUKDgiIVnEI9fVxCAxR8_f08Q_yDgDI8DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-3N_IwMjIyNDM1NTE0dCYOFUA87cpXA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CHEMICAL MECHANICAL POLISHING SLURRY BUILDUP MONITORING</title><source>esp@cenet</source><creator>LI, Thomas Ho Fai</creator><creatorcontrib>LI, Thomas Ho Fai</creatorcontrib><description>An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.
Sont divulgués un appareil et un procédé de surveillance de l'accumulation de boue. Un appareil de polissage de substrat comprend une surface revêtue au moins en partie d'un matériau fluorescent, d'une source de lumière conçue pour éclairer la surface, d'un capteur d'image conçu pour imager la surface, et d'un processeur accouplé au capteur d'image et conçu pour surveiller l'accumulation de boue sur la surface au moyen de données fournies par le capteur d'image.</description><language>eng ; fre</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221013&DB=EPODOC&CC=WO&NR=2022216554A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221013&DB=EPODOC&CC=WO&NR=2022216554A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI, Thomas Ho Fai</creatorcontrib><title>CHEMICAL MECHANICAL POLISHING SLURRY BUILDUP MONITORING</title><description>An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.
Sont divulgués un appareil et un procédé de surveillance de l'accumulation de boue. Un appareil de polissage de substrat comprend une surface revêtue au moins en partie d'un matériau fluorescent, d'une source de lumière conçue pour éclairer la surface, d'un capteur d'image conçu pour imager la surface, et d'un processeur accouplé au capteur d'image et conçu pour surveiller l'accumulation de boue sur la surface au moyen de données fournies par le capteur d'image.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB39nD19XR29FHwdXX2cPQDMwP8fTyDPTz93BWCfUKDgiIVnEI9fVxCAxR8_f08Q_yDgDI8DKxpiTnFqbxQmptB2c01xNlDN7UgPz61uCAxOTUvtSQ-3N_IwMjIyNDM1NTE0dCYOFUA87cpXA</recordid><startdate>20221013</startdate><enddate>20221013</enddate><creator>LI, Thomas Ho Fai</creator><scope>EVB</scope></search><sort><creationdate>20221013</creationdate><title>CHEMICAL MECHANICAL POLISHING SLURRY BUILDUP MONITORING</title><author>LI, Thomas Ho Fai</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022216554A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2022</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LI, Thomas Ho Fai</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI, Thomas Ho Fai</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHEMICAL MECHANICAL POLISHING SLURRY BUILDUP MONITORING</title><date>2022-10-13</date><risdate>2022</risdate><abstract>An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.
Sont divulgués un appareil et un procédé de surveillance de l'accumulation de boue. Un appareil de polissage de substrat comprend une surface revêtue au moins en partie d'un matériau fluorescent, d'une source de lumière conçue pour éclairer la surface, d'un capteur d'image conçu pour imager la surface, et d'un processeur accouplé au capteur d'image et conçu pour surveiller l'accumulation de boue sur la surface au moyen de données fournies par le capteur d'image.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2022216554A1 |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | CHEMICAL MECHANICAL POLISHING SLURRY BUILDUP MONITORING |
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