ELECTRONIC DEVICE COMPRISING HOUSING AND METHOD FOR MANUFACTURING SAME
Disclosed in various embodiments of the present disclosure are an electronic device comprising a dual-textured housing and a method for manufacturing same. Various embodiments of the present disclosure may provide an electronic device comprising a housing which comprises: a first surface having a fi...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; kor |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHOI, Sanggyou KIM, Sunghoon PARK, Sungjin JANG, Youngsoo LEE, Jinho CHOI, Byounghee HWANG, Yongwook |
| description | Disclosed in various embodiments of the present disclosure are an electronic device comprising a dual-textured housing and a method for manufacturing same. Various embodiments of the present disclosure may provide an electronic device comprising a housing which comprises: a first surface having a first surface roughness; a second surface having a second surface roughness different from that of the first surface; and a first connection portion between the first surface and the second surface. The electronic device may further comprise an oxide coating layer disposed on the first surface, the second surface, and the first connection portion and formed to have a substantially uniform thickness. Various other embodiments may also be employed.
Divers modes de réalisation de la présente divulgation concernent un dispositif électronique comprenant un boîtier à double texture et son procédé de fabrication. Divers modes de réalisation de la présente divulgation peuvent fournir un dispositif électronique comprenant un boîtier qui comprend : une première surface ayant une première rugosité de surface ; une deuxième surface ayant une deuxième rugosité de surface différente de celle de la première surface ; et une première partie de connexion entre la première surface et la deuxième surface. Le dispositif électronique peut en outre comprendre une couche de revêtement d'oxyde disposée sur la première surface, la deuxième surface, et la première partie de connexion et formée pour avoir une épaisseur sensiblement uniforme. Divers autres modes de réalisation peuvent également être utilisés.
본 개시의 다양한 실시예들에서는, 이중 질감을 가지는 하우징을 포함하는 전자 장치 및 그에 대한 제조 방법을 개시한다. 본 개시의 다양한 실시예들에 따르면, 제 1 표면 조도를 가지는 제 1 면; 및 상기 제 1 면과 다른 제 2 표면 조도를 가지는 제 2 면을 포함하고, 상기 제 1 면과 상기 제 2 면 사이의 제 1 연결부분을 포함하는 하우징을 포함하는 전자 장치를 제공할 수 있다. 상기 전자 장치는 상기 제 1 면, 상기 제 2 면 및 상기 제 1 연결부분 상에 배치되고, 실질적으로 동일한 두께를 가지도록 형성된 산화 피막층을 더 포함할 수 있다. 이 밖에 다양한 실시예들이 적용될 수 있다. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2022197120A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2022197120A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2022197120A13</originalsourceid><addsrcrecordid>eNrjZHBz9XF1Dgny9_N0VnBxDfN0dlVw9vcNCPIM9vRzV_DwDwXTjn4uCr6uIR7-Lgpu_kEKvo5-oW6OziGhQSDJYEdfVx4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh_ub2RgZGRoaW5oZOBoaEycKgBkhy02</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC DEVICE COMPRISING HOUSING AND METHOD FOR MANUFACTURING SAME</title><source>esp@cenet</source><creator>CHOI, Sanggyou ; KIM, Sunghoon ; PARK, Sungjin ; JANG, Youngsoo ; LEE, Jinho ; CHOI, Byounghee ; HWANG, Yongwook</creator><creatorcontrib>CHOI, Sanggyou ; KIM, Sunghoon ; PARK, Sungjin ; JANG, Youngsoo ; LEE, Jinho ; CHOI, Byounghee ; HWANG, Yongwook</creatorcontrib><description>Disclosed in various embodiments of the present disclosure are an electronic device comprising a dual-textured housing and a method for manufacturing same. Various embodiments of the present disclosure may provide an electronic device comprising a housing which comprises: a first surface having a first surface roughness; a second surface having a second surface roughness different from that of the first surface; and a first connection portion between the first surface and the second surface. The electronic device may further comprise an oxide coating layer disposed on the first surface, the second surface, and the first connection portion and formed to have a substantially uniform thickness. Various other embodiments may also be employed.
Divers modes de réalisation de la présente divulgation concernent un dispositif électronique comprenant un boîtier à double texture et son procédé de fabrication. Divers modes de réalisation de la présente divulgation peuvent fournir un dispositif électronique comprenant un boîtier qui comprend : une première surface ayant une première rugosité de surface ; une deuxième surface ayant une deuxième rugosité de surface différente de celle de la première surface ; et une première partie de connexion entre la première surface et la deuxième surface. Le dispositif électronique peut en outre comprendre une couche de revêtement d'oxyde disposée sur la première surface, la deuxième surface, et la première partie de connexion et formée pour avoir une épaisseur sensiblement uniforme. Divers autres modes de réalisation peuvent également être utilisés.
본 개시의 다양한 실시예들에서는, 이중 질감을 가지는 하우징을 포함하는 전자 장치 및 그에 대한 제조 방법을 개시한다. 본 개시의 다양한 실시예들에 따르면, 제 1 표면 조도를 가지는 제 1 면; 및 상기 제 1 면과 다른 제 2 표면 조도를 가지는 제 2 면을 포함하고, 상기 제 1 면과 상기 제 2 면 사이의 제 1 연결부분을 포함하는 하우징을 포함하는 전자 장치를 제공할 수 있다. 상기 전자 장치는 상기 제 1 면, 상기 제 2 면 및 상기 제 1 연결부분 상에 배치되고, 실질적으로 동일한 두께를 가지도록 형성된 산화 피막층을 더 포함할 수 있다. 이 밖에 다양한 실시예들이 적용될 수 있다.</description><language>eng ; fre ; kor</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TELEPHONIC COMMUNICATION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220922&DB=EPODOC&CC=WO&NR=2022197120A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220922&DB=EPODOC&CC=WO&NR=2022197120A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI, Sanggyou</creatorcontrib><creatorcontrib>KIM, Sunghoon</creatorcontrib><creatorcontrib>PARK, Sungjin</creatorcontrib><creatorcontrib>JANG, Youngsoo</creatorcontrib><creatorcontrib>LEE, Jinho</creatorcontrib><creatorcontrib>CHOI, Byounghee</creatorcontrib><creatorcontrib>HWANG, Yongwook</creatorcontrib><title>ELECTRONIC DEVICE COMPRISING HOUSING AND METHOD FOR MANUFACTURING SAME</title><description>Disclosed in various embodiments of the present disclosure are an electronic device comprising a dual-textured housing and a method for manufacturing same. Various embodiments of the present disclosure may provide an electronic device comprising a housing which comprises: a first surface having a first surface roughness; a second surface having a second surface roughness different from that of the first surface; and a first connection portion between the first surface and the second surface. The electronic device may further comprise an oxide coating layer disposed on the first surface, the second surface, and the first connection portion and formed to have a substantially uniform thickness. Various other embodiments may also be employed.
Divers modes de réalisation de la présente divulgation concernent un dispositif électronique comprenant un boîtier à double texture et son procédé de fabrication. Divers modes de réalisation de la présente divulgation peuvent fournir un dispositif électronique comprenant un boîtier qui comprend : une première surface ayant une première rugosité de surface ; une deuxième surface ayant une deuxième rugosité de surface différente de celle de la première surface ; et une première partie de connexion entre la première surface et la deuxième surface. Le dispositif électronique peut en outre comprendre une couche de revêtement d'oxyde disposée sur la première surface, la deuxième surface, et la première partie de connexion et formée pour avoir une épaisseur sensiblement uniforme. Divers autres modes de réalisation peuvent également être utilisés.
본 개시의 다양한 실시예들에서는, 이중 질감을 가지는 하우징을 포함하는 전자 장치 및 그에 대한 제조 방법을 개시한다. 본 개시의 다양한 실시예들에 따르면, 제 1 표면 조도를 가지는 제 1 면; 및 상기 제 1 면과 다른 제 2 표면 조도를 가지는 제 2 면을 포함하고, 상기 제 1 면과 상기 제 2 면 사이의 제 1 연결부분을 포함하는 하우징을 포함하는 전자 장치를 제공할 수 있다. 상기 전자 장치는 상기 제 1 면, 상기 제 2 면 및 상기 제 1 연결부분 상에 배치되고, 실질적으로 동일한 두께를 가지도록 형성된 산화 피막층을 더 포함할 수 있다. 이 밖에 다양한 실시예들이 적용될 수 있다.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBz9XF1Dgny9_N0VnBxDfN0dlVw9vcNCPIM9vRzV_DwDwXTjn4uCr6uIR7-Lgpu_kEKvo5-oW6OziGhQSDJYEdfVx4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh_ub2RgZGRoaW5oZOBoaEycKgBkhy02</recordid><startdate>20220922</startdate><enddate>20220922</enddate><creator>CHOI, Sanggyou</creator><creator>KIM, Sunghoon</creator><creator>PARK, Sungjin</creator><creator>JANG, Youngsoo</creator><creator>LEE, Jinho</creator><creator>CHOI, Byounghee</creator><creator>HWANG, Yongwook</creator><scope>EVB</scope></search><sort><creationdate>20220922</creationdate><title>ELECTRONIC DEVICE COMPRISING HOUSING AND METHOD FOR MANUFACTURING SAME</title><author>CHOI, Sanggyou ; KIM, Sunghoon ; PARK, Sungjin ; JANG, Youngsoo ; LEE, Jinho ; CHOI, Byounghee ; HWANG, Yongwook</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022197120A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2022</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI, Sanggyou</creatorcontrib><creatorcontrib>KIM, Sunghoon</creatorcontrib><creatorcontrib>PARK, Sungjin</creatorcontrib><creatorcontrib>JANG, Youngsoo</creatorcontrib><creatorcontrib>LEE, Jinho</creatorcontrib><creatorcontrib>CHOI, Byounghee</creatorcontrib><creatorcontrib>HWANG, Yongwook</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI, Sanggyou</au><au>KIM, Sunghoon</au><au>PARK, Sungjin</au><au>JANG, Youngsoo</au><au>LEE, Jinho</au><au>CHOI, Byounghee</au><au>HWANG, Yongwook</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE COMPRISING HOUSING AND METHOD FOR MANUFACTURING SAME</title><date>2022-09-22</date><risdate>2022</risdate><abstract>Disclosed in various embodiments of the present disclosure are an electronic device comprising a dual-textured housing and a method for manufacturing same. Various embodiments of the present disclosure may provide an electronic device comprising a housing which comprises: a first surface having a first surface roughness; a second surface having a second surface roughness different from that of the first surface; and a first connection portion between the first surface and the second surface. The electronic device may further comprise an oxide coating layer disposed on the first surface, the second surface, and the first connection portion and formed to have a substantially uniform thickness. Various other embodiments may also be employed.
Divers modes de réalisation de la présente divulgation concernent un dispositif électronique comprenant un boîtier à double texture et son procédé de fabrication. Divers modes de réalisation de la présente divulgation peuvent fournir un dispositif électronique comprenant un boîtier qui comprend : une première surface ayant une première rugosité de surface ; une deuxième surface ayant une deuxième rugosité de surface différente de celle de la première surface ; et une première partie de connexion entre la première surface et la deuxième surface. Le dispositif électronique peut en outre comprendre une couche de revêtement d'oxyde disposée sur la première surface, la deuxième surface, et la première partie de connexion et formée pour avoir une épaisseur sensiblement uniforme. Divers autres modes de réalisation peuvent également être utilisés.
본 개시의 다양한 실시예들에서는, 이중 질감을 가지는 하우징을 포함하는 전자 장치 및 그에 대한 제조 방법을 개시한다. 본 개시의 다양한 실시예들에 따르면, 제 1 표면 조도를 가지는 제 1 면; 및 상기 제 1 면과 다른 제 2 표면 조도를 가지는 제 2 면을 포함하고, 상기 제 1 면과 상기 제 2 면 사이의 제 1 연결부분을 포함하는 하우징을 포함하는 전자 장치를 제공할 수 있다. 상기 전자 장치는 상기 제 1 면, 상기 제 2 면 및 상기 제 1 연결부분 상에 배치되고, 실질적으로 동일한 두께를 가지도록 형성된 산화 피막층을 더 포함할 수 있다. 이 밖에 다양한 실시예들이 적용될 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; kor |
| recordid | cdi_epo_espacenet_WO2022197120A1 |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TELEPHONIC COMMUNICATION |
| title | ELECTRONIC DEVICE COMPRISING HOUSING AND METHOD FOR MANUFACTURING SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T09%3A41%3A55IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHOI,%20Sanggyou&rft.date=2022-09-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2022197120A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |