PHOTOSENSITIVE CHIP, AND PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, CAMERA MODULE, AND ELECTRONIC DEVICE

The present application relates to a photosensitive chip, and a packaging structure and a manufacturing method therefor, a camera module, and an electronic device. The photosensitive chip and the packaging structure comprise a circuit board, a photosensitive chip, an adhesive, a light transmitting s...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHEN, Chengzhe, LIU, Xiu, MU, Jiangtao
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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