PHOTOSENSITIVE CHIP, AND PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, CAMERA MODULE, AND ELECTRONIC DEVICE

The present application relates to a photosensitive chip, and a packaging structure and a manufacturing method therefor, a camera module, and an electronic device. The photosensitive chip and the packaging structure comprise a circuit board, a photosensitive chip, an adhesive, a light transmitting sheet, a conductive connecting wire, and a filling body. The photosensitive chip is arranged on one side of the circuit board along the direction of an optical axis; the photosensitive chip has a photosensitive surface distant from the circuit board and a first side surface connected to the photosensitive surface; the photosensitive surface has a main area and an edge area located at the periphery of the main area; the adhesive is at least partially disposed in the edge area; the light transmitting sheet is disposed on the side of the adhesive distant from the edge area, and the light transmitting sheet is supported by the adhesive and fixed to the side of the photosensitive chip distant from the circuit board; the