CONFIGURABLE LEADED PACKAGE

A semiconductor package includes a base insulating layer (102); a semiconductor die (106) attached to a portion of the base insulating layer (102); and a first continuous lead (120) electrically connected to the semiconductor die. The first continuous lead (120) includes a first lateral extension (1...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KODURI, Sreenivasan Kalyani
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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