ELECTRONIC DEVICE HEAT DISSIPATION APPARATUS HAVING SEMICONDUCTOR AUXILIARY HEAT PUMP

Disclosed is an electronic device heat dissipation apparatus having a semiconductor auxiliary heat pump. The electronic device heat dissipation apparatus comprises a main heat dissipation fin group, a first heat pipe group, a first heat absorption module and a semiconductor auxiliary heat pump. The first heat pipe group comprises a heat absorption end and a heat dissipation end. The heat absorption end of the first heat pipe group is tightly attached to a heating area of the electronic device by means of the first heat absorption module, and the heat dissipation end of the first heat pipe group penetrates through the main heat dissipation fin group. The semiconductor auxiliary heat pump comprises a semiconductor refrigeration unit and a cold conduction assembly. The semiconductor refrigeration unit is provided with a cold surface and a hot surface. A part of the cold conduction assembly is arranged at one end of the cold surface to absorb cold, and another part is arranged on the main heat dissipation fin gro