SUBSTRATE-STACKED STRUCTURE AND INTERPOSER BLOCK
Provided is a substrate-stacked structure including: a first substrate; a second substrate arranged to overlap the first substrate; and a plurality of interposer blocks positioned between the first substrate and the second substrate and spaced apart from each other, wherein the interposer blocks inc...
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| creator | PARK, Inkyu KIM, Kipoung LEE, Youngjik KIM, Sanggeun SEO, Jungtae KIM, Youngkweon |
| description | Provided is a substrate-stacked structure including: a first substrate; a second substrate arranged to overlap the first substrate; and a plurality of interposer blocks positioned between the first substrate and the second substrate and spaced apart from each other, wherein the interposer blocks include: a block body including a dielectric; a plurality of signal vias passing through the block body to transmit a signal between the first substrate and the second substrate; and a plurality of signal pads positioned at both ends of each of the signal vias and connected to the first substrate and the second substrate. Accordingly, in the substrate-stacked structure, a mounting area on the substrates may be secured.
L'invention concerne une structure empilée sur un substrat comprenant : un premier substrat ; un second substrat agencé pour chevaucher le premier substrat ; et une pluralité de blocs d'interposition positionnés entre le premier substrat et le second substrat et espacés l'un de l'autre, les blocs d'interposeur comprenant : un corps de bloc comprenant un diélectrique ; une pluralité de trous d'interconnexion de signal passant à travers le corps de bloc pour transmettre un signal entre le premier substrat et le second substrat ; et une pluralité de pastilles de signal positionnées aux deux extrémités de chacun des trous d'interconnexion de signal et connectées au premier substrat et au second substrat. Par conséquent, dans la structure empilée sur substrat, une zone de montage sur les substrats peut être fixée.
제1 기판; 상기 제1 기판과 중첩 배치되는 제2 기판; 상기 제1 기판과 상기 제2 기판 사이에 위치하며 복수개가 이격되어 배치되는 인터포저 블록을 포함하고, 상기 인터포저 블록은, 유전체를 포함하는 블록바디; 상기 블록바디를 관통하여 상기 제1 기판과 상기 제2 기판 사이의 신호를 전달하는 복수개의 시그널 비아; 및 상기 시그널 비아 각각의 양 단부에 위치하며 상기 제1 기판과 상기 제2 기판과 접속하는 복수개의 시그널 패드를 포함하는 기판적층 구조체는 기판상 실장면적을 확보할 수 있다. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2022138990A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2022138990A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2022138990A13</originalsourceid><addsrcrecordid>eNrjZDAIDnUKDglyDHHVDQ5xdPZ2dVEAckOdQ0KDXBUc_VwUPP1CXIMC_INdgxScfPydvXkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXy4v5GBkZGhsYWlpYGjoTFxqgDy5ieS</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE-STACKED STRUCTURE AND INTERPOSER BLOCK</title><source>esp@cenet</source><creator>PARK, Inkyu ; KIM, Kipoung ; LEE, Youngjik ; KIM, Sanggeun ; SEO, Jungtae ; KIM, Youngkweon</creator><creatorcontrib>PARK, Inkyu ; KIM, Kipoung ; LEE, Youngjik ; KIM, Sanggeun ; SEO, Jungtae ; KIM, Youngkweon</creatorcontrib><description>Provided is a substrate-stacked structure including: a first substrate; a second substrate arranged to overlap the first substrate; and a plurality of interposer blocks positioned between the first substrate and the second substrate and spaced apart from each other, wherein the interposer blocks include: a block body including a dielectric; a plurality of signal vias passing through the block body to transmit a signal between the first substrate and the second substrate; and a plurality of signal pads positioned at both ends of each of the signal vias and connected to the first substrate and the second substrate. Accordingly, in the substrate-stacked structure, a mounting area on the substrates may be secured.
L'invention concerne une structure empilée sur un substrat comprenant : un premier substrat ; un second substrat agencé pour chevaucher le premier substrat ; et une pluralité de blocs d'interposition positionnés entre le premier substrat et le second substrat et espacés l'un de l'autre, les blocs d'interposeur comprenant : un corps de bloc comprenant un diélectrique ; une pluralité de trous d'interconnexion de signal passant à travers le corps de bloc pour transmettre un signal entre le premier substrat et le second substrat ; et une pluralité de pastilles de signal positionnées aux deux extrémités de chacun des trous d'interconnexion de signal et connectées au premier substrat et au second substrat. Par conséquent, dans la structure empilée sur substrat, une zone de montage sur les substrats peut être fixée.
제1 기판; 상기 제1 기판과 중첩 배치되는 제2 기판; 상기 제1 기판과 상기 제2 기판 사이에 위치하며 복수개가 이격되어 배치되는 인터포저 블록을 포함하고, 상기 인터포저 블록은, 유전체를 포함하는 블록바디; 상기 블록바디를 관통하여 상기 제1 기판과 상기 제2 기판 사이의 신호를 전달하는 복수개의 시그널 비아; 및 상기 시그널 비아 각각의 양 단부에 위치하며 상기 제1 기판과 상기 제2 기판과 접속하는 복수개의 시그널 패드를 포함하는 기판적층 구조체는 기판상 실장면적을 확보할 수 있다.</description><language>eng ; fre ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TELEPHONIC COMMUNICATION</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220630&DB=EPODOC&CC=WO&NR=2022138990A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220630&DB=EPODOC&CC=WO&NR=2022138990A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK, Inkyu</creatorcontrib><creatorcontrib>KIM, Kipoung</creatorcontrib><creatorcontrib>LEE, Youngjik</creatorcontrib><creatorcontrib>KIM, Sanggeun</creatorcontrib><creatorcontrib>SEO, Jungtae</creatorcontrib><creatorcontrib>KIM, Youngkweon</creatorcontrib><title>SUBSTRATE-STACKED STRUCTURE AND INTERPOSER BLOCK</title><description>Provided is a substrate-stacked structure including: a first substrate; a second substrate arranged to overlap the first substrate; and a plurality of interposer blocks positioned between the first substrate and the second substrate and spaced apart from each other, wherein the interposer blocks include: a block body including a dielectric; a plurality of signal vias passing through the block body to transmit a signal between the first substrate and the second substrate; and a plurality of signal pads positioned at both ends of each of the signal vias and connected to the first substrate and the second substrate. Accordingly, in the substrate-stacked structure, a mounting area on the substrates may be secured.
L'invention concerne une structure empilée sur un substrat comprenant : un premier substrat ; un second substrat agencé pour chevaucher le premier substrat ; et une pluralité de blocs d'interposition positionnés entre le premier substrat et le second substrat et espacés l'un de l'autre, les blocs d'interposeur comprenant : un corps de bloc comprenant un diélectrique ; une pluralité de trous d'interconnexion de signal passant à travers le corps de bloc pour transmettre un signal entre le premier substrat et le second substrat ; et une pluralité de pastilles de signal positionnées aux deux extrémités de chacun des trous d'interconnexion de signal et connectées au premier substrat et au second substrat. Par conséquent, dans la structure empilée sur substrat, une zone de montage sur les substrats peut être fixée.
제1 기판; 상기 제1 기판과 중첩 배치되는 제2 기판; 상기 제1 기판과 상기 제2 기판 사이에 위치하며 복수개가 이격되어 배치되는 인터포저 블록을 포함하고, 상기 인터포저 블록은, 유전체를 포함하는 블록바디; 상기 블록바디를 관통하여 상기 제1 기판과 상기 제2 기판 사이의 신호를 전달하는 복수개의 시그널 비아; 및 상기 시그널 비아 각각의 양 단부에 위치하며 상기 제1 기판과 상기 제2 기판과 접속하는 복수개의 시그널 패드를 포함하는 기판적층 구조체는 기판상 실장면적을 확보할 수 있다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TELEPHONIC COMMUNICATION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIDnUKDglyDHHVDQ5xdPZ2dVEAckOdQ0KDXBUc_VwUPP1CXIMC_INdgxScfPydvXkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXy4v5GBkZGhsYWlpYGjoTFxqgDy5ieS</recordid><startdate>20220630</startdate><enddate>20220630</enddate><creator>PARK, Inkyu</creator><creator>KIM, Kipoung</creator><creator>LEE, Youngjik</creator><creator>KIM, Sanggeun</creator><creator>SEO, Jungtae</creator><creator>KIM, Youngkweon</creator><scope>EVB</scope></search><sort><creationdate>20220630</creationdate><title>SUBSTRATE-STACKED STRUCTURE AND INTERPOSER BLOCK</title><author>PARK, Inkyu ; KIM, Kipoung ; LEE, Youngjik ; KIM, Sanggeun ; SEO, Jungtae ; KIM, Youngkweon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022138990A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TELEPHONIC COMMUNICATION</topic><toplevel>online_resources</toplevel><creatorcontrib>PARK, Inkyu</creatorcontrib><creatorcontrib>KIM, Kipoung</creatorcontrib><creatorcontrib>LEE, Youngjik</creatorcontrib><creatorcontrib>KIM, Sanggeun</creatorcontrib><creatorcontrib>SEO, Jungtae</creatorcontrib><creatorcontrib>KIM, Youngkweon</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARK, Inkyu</au><au>KIM, Kipoung</au><au>LEE, Youngjik</au><au>KIM, Sanggeun</au><au>SEO, Jungtae</au><au>KIM, Youngkweon</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE-STACKED STRUCTURE AND INTERPOSER BLOCK</title><date>2022-06-30</date><risdate>2022</risdate><abstract>Provided is a substrate-stacked structure including: a first substrate; a second substrate arranged to overlap the first substrate; and a plurality of interposer blocks positioned between the first substrate and the second substrate and spaced apart from each other, wherein the interposer blocks include: a block body including a dielectric; a plurality of signal vias passing through the block body to transmit a signal between the first substrate and the second substrate; and a plurality of signal pads positioned at both ends of each of the signal vias and connected to the first substrate and the second substrate. Accordingly, in the substrate-stacked structure, a mounting area on the substrates may be secured.
L'invention concerne une structure empilée sur un substrat comprenant : un premier substrat ; un second substrat agencé pour chevaucher le premier substrat ; et une pluralité de blocs d'interposition positionnés entre le premier substrat et le second substrat et espacés l'un de l'autre, les blocs d'interposeur comprenant : un corps de bloc comprenant un diélectrique ; une pluralité de trous d'interconnexion de signal passant à travers le corps de bloc pour transmettre un signal entre le premier substrat et le second substrat ; et une pluralité de pastilles de signal positionnées aux deux extrémités de chacun des trous d'interconnexion de signal et connectées au premier substrat et au second substrat. Par conséquent, dans la structure empilée sur substrat, une zone de montage sur les substrats peut être fixée.
제1 기판; 상기 제1 기판과 중첩 배치되는 제2 기판; 상기 제1 기판과 상기 제2 기판 사이에 위치하며 복수개가 이격되어 배치되는 인터포저 블록을 포함하고, 상기 인터포저 블록은, 유전체를 포함하는 블록바디; 상기 블록바디를 관통하여 상기 제1 기판과 상기 제2 기판 사이의 신호를 전달하는 복수개의 시그널 비아; 및 상기 시그널 비아 각각의 양 단부에 위치하며 상기 제1 기판과 상기 제2 기판과 접속하는 복수개의 시그널 패드를 포함하는 기판적층 구조체는 기판상 실장면적을 확보할 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TELEPHONIC COMMUNICATION |
| title | SUBSTRATE-STACKED STRUCTURE AND INTERPOSER BLOCK |
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