METHODS OF BONDING COPPER AND ARTICLES FORMED THEREBY

Articles that include at least two substrates; and an adhesion promoter, wherein the adhesion promoter is a compound of formula I, (I) wherein x is an integer from 1 to 4, y is an integer from 2 to 6, and z is an integer from 1 to 6; and a structural adhesive positioned at least between the two subs...

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Bibliographische Detailangaben
1. Verfasser:	KRYGER, Matthew J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Articles that include at least two substrates; and an adhesion promoter, wherein the adhesion promoter is a compound of formula I, (I) wherein x is an integer from 1 to 4, y is an integer from 2 to 6, and z is an integer from 1 to 6; and a structural adhesive positioned at least between the two substrates. Structural adhesives including such adhesion promoters and methods for bonding two substrates are also disclosed herein. L'invention concerne des articles qui comprennent au moins deux substrats ; un promoteur d'adhérence, le promoteur d'adhérence étant un composé de formule I, (I), x étant un nombre entier de 1 à 4, y étant un nombre entier de 2 à 6 et z étant un nombre entier de 1 à 6 ; et un adhésif structural positionné au moins entre les deux substrats. La présente invention concerne également des adhésifs structuraux comprenant de tels promoteurs d'adhérence et des procédés pour le collage de deux substrats.