METHOD FOR DEPOSITING A BRONZE ALLOY ON A PRINTED CIRCUIT AND PRINTED CIRCUIT OBTAINED BY SAID METHOD

Disclosed is a method for depositing a bronze alloy on a printed circuit (5). Said method comprises an operation of electrolytically depositing at least one layer of bronze (12) on a copper sheet (10). The bronze layer (12) comprises, after deposition, 45-65% by weight of copper, 35-45% by weight of...

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Hauptverfasser: SANSON, Jérôme, COQUILLARD, Stéphanie
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Sprache:eng ; fre
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creator SANSON, Jérôme
COQUILLARD, Stéphanie
description Disclosed is a method for depositing a bronze alloy on a printed circuit (5). Said method comprises an operation of electrolytically depositing at least one layer of bronze (12) on a copper sheet (10). The bronze layer (12) comprises, after deposition, 45-65% by weight of copper, 35-45% by weight of tin and 2-11% by weight of zinc. Also disclosed is a printed circuit (5) obtained by this method. Procédé de dépôt d'un alliage de bronze sur un circuit imprimé (5). Ce procédé comprend une opération de dépôt électrolytique d'au moins une couche de bronze (12) sur un feuillet de cuivre (10). La couche de bronze (12) comprend après dépôt 45-65% en poids de cuivre, 30 à 45% en poids d'étain et 2 à 11 % en poids de zinc. Circuit imprimé (5) obtenu par ce procédé.
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Said method comprises an operation of electrolytically depositing at least one layer of bronze (12) on a copper sheet (10). The bronze layer (12) comprises, after deposition, 45-65% by weight of copper, 35-45% by weight of tin and 2-11% by weight of zinc. Also disclosed is a printed circuit (5) obtained by this method. Procédé de dépôt d'un alliage de bronze sur un circuit imprimé (5). Ce procédé comprend une opération de dépôt électrolytique d'au moins une couche de bronze (12) sur un feuillet de cuivre (10). La couche de bronze (12) comprend après dépôt 45-65% en poids de cuivre, 30 à 45% en poids d'étain et 2 à 11 % en poids de zinc. 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Said method comprises an operation of electrolytically depositing at least one layer of bronze (12) on a copper sheet (10). The bronze layer (12) comprises, after deposition, 45-65% by weight of copper, 35-45% by weight of tin and 2-11% by weight of zinc. Also disclosed is a printed circuit (5) obtained by this method. Procédé de dépôt d'un alliage de bronze sur un circuit imprimé (5). Ce procédé comprend une opération de dépôt électrolytique d'au moins une couche de bronze (12) sur un feuillet de cuivre (10). La couche de bronze (12) comprend après dépôt 45-65% en poids de cuivre, 30 à 45% en poids d'étain et 2 à 11 % en poids de zinc. 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Said method comprises an operation of electrolytically depositing at least one layer of bronze (12) on a copper sheet (10). The bronze layer (12) comprises, after deposition, 45-65% by weight of copper, 35-45% by weight of tin and 2-11% by weight of zinc. Also disclosed is a printed circuit (5) obtained by this method. Procédé de dépôt d'un alliage de bronze sur un circuit imprimé (5). Ce procédé comprend une opération de dépôt électrolytique d'au moins une couche de bronze (12) sur un feuillet de cuivre (10). La couche de bronze (12) comprend après dépôt 45-65% en poids de cuivre, 30 à 45% en poids d'étain et 2 à 11 % en poids de zinc. Circuit imprimé (5) obtenu par ce procédé.</abstract><oa>free_for_read</oa></addata></record>
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subjects APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
HANDLING RECORD CARRIERS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED CIRCUITS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
TRANSPORTING
title METHOD FOR DEPOSITING A BRONZE ALLOY ON A PRINTED CIRCUIT AND PRINTED CIRCUIT OBTAINED BY SAID METHOD
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