METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME
The present invention relates to a metal foil having a rough surface, a metal foil with a carrier comprising the metal foil, and a printed circuit board manufacturing by using the metal foil. The metal foil, according to the present invention, has a rough surface naturally formed during a manufactur...
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| creator | KO, Nak Eun SIM, Ju Yong CHUNG, Bo Mook KIM, Dae Geun CHUN, Sung Wook PARK, Myong Whan |
| description | The present invention relates to a metal foil having a rough surface, a metal foil with a carrier comprising the metal foil, and a printed circuit board manufacturing by using the metal foil. The metal foil, according to the present invention, has a rough surface naturally formed during a manufacturing process, and thus has high adhesion to an insulating resin substrate and can improve the manufacturing efficiency of the printed circuit board.
La présente invention concerne une feuille métallique ayant une surface rugueuse, une feuille métallique avec un support comprenant la feuille métallique, et une fabrication de carte de circuit imprimé en utilisant la feuille métallique. La feuille métallique, selon la présente invention, a une surface rugueuse formée naturellement pendant un processus de fabrication, et présente ainsi une adhérence élevée à un substrat de résine isolante et peut améliorer l'efficacité de fabrication de la carte de circuit imprimé.
본 발명은 조화면을 갖는 금속박, 상기 금속박을 포함하는 캐리어 부착 금속박 및 상기 금속박을 이용하여 제조되는 인쇄회로기판에 관한 것이다. 본 발명에 따른 금속박은 제조과정에서 자연스럽게 조화면이 형성되어 절연 수지 기재와 높은 밀착력을 가지면서 인쇄회로기판의 제조 효율을 향상시킬 수 있다. |
| format | Patent |
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La présente invention concerne une feuille métallique ayant une surface rugueuse, une feuille métallique avec un support comprenant la feuille métallique, et une fabrication de carte de circuit imprimé en utilisant la feuille métallique. La feuille métallique, selon la présente invention, a une surface rugueuse formée naturellement pendant un processus de fabrication, et présente ainsi une adhérence élevée à un substrat de résine isolante et peut améliorer l'efficacité de fabrication de la carte de circuit imprimé.
본 발명은 조화면을 갖는 금속박, 상기 금속박을 포함하는 캐리어 부착 금속박 및 상기 금속박을 이용하여 제조되는 인쇄회로기판에 관한 것이다. 본 발명에 따른 금속박은 제조과정에서 자연스럽게 조화면이 형성되어 절연 수지 기재와 높은 밀착력을 가지면서 인쇄회로기판의 제조 효율을 향상시킬 수 있다.</description><language>eng ; fre ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220616&DB=EPODOC&CC=WO&NR=2022124842A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220616&DB=EPODOC&CC=WO&NR=2022124842A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KO, Nak Eun</creatorcontrib><creatorcontrib>SIM, Ju Yong</creatorcontrib><creatorcontrib>CHUNG, Bo Mook</creatorcontrib><creatorcontrib>KIM, Dae Geun</creatorcontrib><creatorcontrib>CHUN, Sung Wook</creatorcontrib><creatorcontrib>PARK, Myong Whan</creatorcontrib><title>METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME</title><description>The present invention relates to a metal foil having a rough surface, a metal foil with a carrier comprising the metal foil, and a printed circuit board manufacturing by using the metal foil. The metal foil, according to the present invention, has a rough surface naturally formed during a manufacturing process, and thus has high adhesion to an insulating resin substrate and can improve the manufacturing efficiency of the printed circuit board.
La présente invention concerne une feuille métallique ayant une surface rugueuse, une feuille métallique avec un support comprenant la feuille métallique, et une fabrication de carte de circuit imprimé en utilisant la feuille métallique. La feuille métallique, selon la présente invention, a une surface rugueuse formée naturellement pendant un processus de fabrication, et présente ainsi une adhérence élevée à un substrat de résine isolante et peut améliorer l'efficacité de fabrication de la carte de circuit imprimé.
본 발명은 조화면을 갖는 금속박, 상기 금속박을 포함하는 캐리어 부착 금속박 및 상기 금속박을 이용하여 제조되는 인쇄회로기판에 관한 것이다. 본 발명에 따른 금속박은 제조과정에서 자연스럽게 조화면이 형성되어 절연 수지 기재와 높은 밀착력을 가지면서 인쇄회로기판의 제조 효율을 향상시킬 수 있다.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjzdQ1x9FFw8_f00VFAsBXCPUM8FJwdg4I8XYMUnP19A4I8gz393BWCHX1ddRQc_VwUgCJ-Ia4uCs6eQc6hniEKTv6OQS7oSnkYWNMSc4pTeaE0N4Oym2uIs4duakF-fGpxQWJyal5qSXy4v5GBkZGhkYmFiZGjoTFxqgCY4TNH</recordid><startdate>20220616</startdate><enddate>20220616</enddate><creator>KO, Nak Eun</creator><creator>SIM, Ju Yong</creator><creator>CHUNG, Bo Mook</creator><creator>KIM, Dae Geun</creator><creator>CHUN, Sung Wook</creator><creator>PARK, Myong Whan</creator><scope>EVB</scope></search><sort><creationdate>20220616</creationdate><title>METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME</title><author>KO, Nak Eun ; SIM, Ju Yong ; CHUNG, Bo Mook ; KIM, Dae Geun ; CHUN, Sung Wook ; PARK, Myong Whan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022124842A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2022</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>KO, Nak Eun</creatorcontrib><creatorcontrib>SIM, Ju Yong</creatorcontrib><creatorcontrib>CHUNG, Bo Mook</creatorcontrib><creatorcontrib>KIM, Dae Geun</creatorcontrib><creatorcontrib>CHUN, Sung Wook</creatorcontrib><creatorcontrib>PARK, Myong Whan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KO, Nak Eun</au><au>SIM, Ju Yong</au><au>CHUNG, Bo Mook</au><au>KIM, Dae Geun</au><au>CHUN, Sung Wook</au><au>PARK, Myong Whan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME</title><date>2022-06-16</date><risdate>2022</risdate><abstract>The present invention relates to a metal foil having a rough surface, a metal foil with a carrier comprising the metal foil, and a printed circuit board manufacturing by using the metal foil. The metal foil, according to the present invention, has a rough surface naturally formed during a manufacturing process, and thus has high adhesion to an insulating resin substrate and can improve the manufacturing efficiency of the printed circuit board.
La présente invention concerne une feuille métallique ayant une surface rugueuse, une feuille métallique avec un support comprenant la feuille métallique, et une fabrication de carte de circuit imprimé en utilisant la feuille métallique. La feuille métallique, selon la présente invention, a une surface rugueuse formée naturellement pendant un processus de fabrication, et présente ainsi une adhérence élevée à un substrat de résine isolante et peut améliorer l'efficacité de fabrication de la carte de circuit imprimé.
본 발명은 조화면을 갖는 금속박, 상기 금속박을 포함하는 캐리어 부착 금속박 및 상기 금속박을 이용하여 제조되는 인쇄회로기판에 관한 것이다. 본 발명에 따른 금속박은 제조과정에서 자연스럽게 조화면이 형성되어 절연 수지 기재와 높은 밀착력을 가지면서 인쇄회로기판의 제조 효율을 향상시킬 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME |
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