FLEXIBLE CIRCUIT BOARD AND PREPARATION METHOD THEREFOR, TOUCH PANEL AND PREPARATION METHOD THEREFOR

A flexible circuit board (10) and a preparation method therefor, and a touch panel and a preparation method therefor. The flexible circuit board (10) has a first binding area (1) and a bending area (2); the flexible circuit board (10) comprises a flexible substrate (3), a conductor layer (42), a fir...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WANG, Jiuzhen, ZHENG, Meizhu
Format: Patent
Sprache:chi ; eng ; fre
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A flexible circuit board (10) and a preparation method therefor, and a touch panel and a preparation method therefor. The flexible circuit board (10) has a first binding area (1) and a bending area (2); the flexible circuit board (10) comprises a flexible substrate (3), a conductor layer (42), a first protective layer (51) and a plurality of first binding pins (41); the plurality of first binding pins (41) are arranged on the flexible substrate (3) of the first binding area (1), and the orthographic projection, on the flexible substrate (3), of an edge line of the first binding pins (41) at one end in an extending direction of the first binding pins (41) is located within an edge of the flexible substrate (3); the conductor layer (42) is arranged on the flexible substrate (3) of the bending area (2), and the conductor layer (42) is connected to the first binding pins (41); and the first protective layer (51) is arranged on the side of the conductor layer (42) away from the flexible substrate (3). During bindi