LOW VISCOSITY THERMALLY CONDUCTIVE PASTE
The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH)3) as a filler for Thermal Interface Materials (TIM). L'invention est basée sur la nouvelle utilisation du trihydroxyde d'aluminium (ATH ou Al(OH)3) en tant que charge pour des matériaux d'interface thermiq...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | AHEARN, Matthew KONG, Stanley Shengqian |
| description | The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH)3) as a filler for Thermal Interface Materials (TIM).
L'invention est basée sur la nouvelle utilisation du trihydroxyde d'aluminium (ATH ou Al(OH)3) en tant que charge pour des matériaux d'interface thermique (TIM). |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2022032277A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2022032277A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2022032277A13</originalsourceid><addsrcrecordid>eNrjZNDw8Q9XCPMMdvYP9gyJVAjxcA3ydfTxiVRw9vdzCXUO8QxzVQhwDA5x5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGRgbGRkbm5o6GxsSpAgDCbiVX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LOW VISCOSITY THERMALLY CONDUCTIVE PASTE</title><source>esp@cenet</source><creator>AHEARN, Matthew ; KONG, Stanley Shengqian</creator><creatorcontrib>AHEARN, Matthew ; KONG, Stanley Shengqian</creatorcontrib><description>The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH)3) as a filler for Thermal Interface Materials (TIM).
L'invention est basée sur la nouvelle utilisation du trihydroxyde d'aluminium (ATH ou Al(OH)3) en tant que charge pour des matériaux d'interface thermique (TIM).</description><language>eng ; fre</language><subject>ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220210&DB=EPODOC&CC=WO&NR=2022032277A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220210&DB=EPODOC&CC=WO&NR=2022032277A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AHEARN, Matthew</creatorcontrib><creatorcontrib>KONG, Stanley Shengqian</creatorcontrib><title>LOW VISCOSITY THERMALLY CONDUCTIVE PASTE</title><description>The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH)3) as a filler for Thermal Interface Materials (TIM).
L'invention est basée sur la nouvelle utilisation du trihydroxyde d'aluminium (ATH ou Al(OH)3) en tant que charge pour des matériaux d'interface thermique (TIM).</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDw8Q9XCPMMdvYP9gyJVAjxcA3ydfTxiVRw9vdzCXUO8QxzVQhwDA5x5WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgZGRgbGRkbm5o6GxsSpAgDCbiVX</recordid><startdate>20220210</startdate><enddate>20220210</enddate><creator>AHEARN, Matthew</creator><creator>KONG, Stanley Shengqian</creator><scope>EVB</scope></search><sort><creationdate>20220210</creationdate><title>LOW VISCOSITY THERMALLY CONDUCTIVE PASTE</title><author>AHEARN, Matthew ; KONG, Stanley Shengqian</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2022032277A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2022</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>AHEARN, Matthew</creatorcontrib><creatorcontrib>KONG, Stanley Shengqian</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AHEARN, Matthew</au><au>KONG, Stanley Shengqian</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LOW VISCOSITY THERMALLY CONDUCTIVE PASTE</title><date>2022-02-10</date><risdate>2022</risdate><abstract>The invention is based on the novel use of Aluminum Trihydroxide (ATH or Al(OH)3) as a filler for Thermal Interface Materials (TIM).
L'invention est basée sur la nouvelle utilisation du trihydroxyde d'aluminium (ATH ou Al(OH)3) en tant que charge pour des matériaux d'interface thermique (TIM).</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2022032277A1 |
| source | esp@cenet |
| subjects | ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | LOW VISCOSITY THERMALLY CONDUCTIVE PASTE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T16%3A00%3A05IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=AHEARN,%20Matthew&rft.date=2022-02-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2022032277A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |