SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEMICONDUCTOR PROCESSING TOOLS
Showerhead faceplates for semiconductor processing chambers are provided that include one or more sets of gas distribution passages therethrough that extend at least partially along axes that are at an oblique angle to the showerhead faceplate center axis. Such angled gas distribution passages may b...
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creator | DORAI, Rajesh DE LA LLERA, Anthony HOLLAND, John MANKIDY, Pratik |
description | Showerhead faceplates for semiconductor processing chambers are provided that include one or more sets of gas distribution passages therethrough that extend at least partially along axes that are at an oblique angle to the showerhead faceplate center axis. Such angled gas distribution passages may be used to tailor the gas flow characteristics of such showerhead faceplates to produce various desired gas flow behaviors in the gas that is delivered to the wafer via such showerhead faceplates.
La présente invention concerne des plaques frontales de pomme de douche destinées à des chambres de traitement de semi-conducteur qui comprennent un ou plusieurs ensembles de passages de distribution de gaz qui s'étendent au moins partiellement le long d'axes qui sont à un angle oblique par rapport à l'axe central de plaque frontale de pomme de douche. De tels passages de distribution de gaz inclinés peuvent être utilisés pour adapter les caractéristiques d'écoulement de gaz de telles plaques frontales de pomme de douche pour produire divers comportements souhaités d'écoulement de gaz pour ce qui est du gaz délivré à la tranche par l'intermédiaire de telles plaques frontales de pomme de douche. |
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La présente invention concerne des plaques frontales de pomme de douche destinées à des chambres de traitement de semi-conducteur qui comprennent un ou plusieurs ensembles de passages de distribution de gaz qui s'étendent au moins partiellement le long d'axes qui sont à un angle oblique par rapport à l'axe central de plaque frontale de pomme de douche. De tels passages de distribution de gaz inclinés peuvent être utilisés pour adapter les caractéristiques d'écoulement de gaz de telles plaques frontales de pomme de douche pour produire divers comportements souhaités d'écoulement de gaz pour ce qui est du gaz délivré à la tranche par l'intermédiaire de telles plaques frontales de pomme de douche.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211223&DB=EPODOC&CC=WO&NR=2021257462A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211223&DB=EPODOC&CC=WO&NR=2021257462A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DORAI, Rajesh</creatorcontrib><creatorcontrib>DE LA LLERA, Anthony</creatorcontrib><creatorcontrib>HOLLAND, John</creatorcontrib><creatorcontrib>MANKIDY, Pratik</creatorcontrib><title>SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEMICONDUCTOR PROCESSING TOOLS</title><description>Showerhead faceplates for semiconductor processing chambers are provided that include one or more sets of gas distribution passages therethrough that extend at least partially along axes that are at an oblique angle to the showerhead faceplate center axis. Such angled gas distribution passages may be used to tailor the gas flow characteristics of such showerhead faceplates to produce various desired gas flow behaviors in the gas that is delivered to the wafer via such showerhead faceplates.
La présente invention concerne des plaques frontales de pomme de douche destinées à des chambres de traitement de semi-conducteur qui comprennent un ou plusieurs ensembles de passages de distribution de gaz qui s'étendent au moins partiellement le long d'axes qui sont à un angle oblique par rapport à l'axe central de plaque frontale de pomme de douche. De tels passages de distribution de gaz inclinés peuvent être utilisés pour adapter les caractéristiques d'écoulement de gaz de telles plaques frontales de pomme de douche pour produire divers comportements souhaités d'écoulement de gaz pour ce qui est du gaz délivré à la tranche par l'intermédiaire de telles plaques frontales de pomme de douche.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyr8KwjAQgPEuDqK-w4GzYOO_-UyuSaDmSi6lm6VInEQL9f3RwQdw-vjgNy-u4rij6AgNVKipqTGRQOeTAwy2JgMWBYyXFP25TZ4DNCiC9qsqjiB08ZqDaXX6XhNZk4gPFhJzLctidh8eU179uijWFSXtNnl89Xkah1t-5nffsdqqUh1O-6PCcvef-gAbIjRC</recordid><startdate>20211223</startdate><enddate>20211223</enddate><creator>DORAI, Rajesh</creator><creator>DE LA LLERA, Anthony</creator><creator>HOLLAND, John</creator><creator>MANKIDY, Pratik</creator><scope>EVB</scope></search><sort><creationdate>20211223</creationdate><title>SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEMICONDUCTOR PROCESSING TOOLS</title><author>DORAI, Rajesh ; DE LA LLERA, Anthony ; HOLLAND, John ; MANKIDY, Pratik</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021257462A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>DORAI, Rajesh</creatorcontrib><creatorcontrib>DE LA LLERA, Anthony</creatorcontrib><creatorcontrib>HOLLAND, John</creatorcontrib><creatorcontrib>MANKIDY, Pratik</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DORAI, Rajesh</au><au>DE LA LLERA, Anthony</au><au>HOLLAND, John</au><au>MANKIDY, Pratik</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEMICONDUCTOR PROCESSING TOOLS</title><date>2021-12-23</date><risdate>2021</risdate><abstract>Showerhead faceplates for semiconductor processing chambers are provided that include one or more sets of gas distribution passages therethrough that extend at least partially along axes that are at an oblique angle to the showerhead faceplate center axis. Such angled gas distribution passages may be used to tailor the gas flow characteristics of such showerhead faceplates to produce various desired gas flow behaviors in the gas that is delivered to the wafer via such showerhead faceplates.
La présente invention concerne des plaques frontales de pomme de douche destinées à des chambres de traitement de semi-conducteur qui comprennent un ou plusieurs ensembles de passages de distribution de gaz qui s'étendent au moins partiellement le long d'axes qui sont à un angle oblique par rapport à l'axe central de plaque frontale de pomme de douche. De tels passages de distribution de gaz inclinés peuvent être utilisés pour adapter les caractéristiques d'écoulement de gaz de telles plaques frontales de pomme de douche pour produire divers comportements souhaités d'écoulement de gaz pour ce qui est du gaz délivré à la tranche par l'intermédiaire de telles plaques frontales de pomme de douche.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre |
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subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
title | SHOWERHEAD FACEPLATES WITH ANGLED GAS DISTRIBUTION PASSAGES FOR SEMICONDUCTOR PROCESSING TOOLS |
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