HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI ENVIRONMENTS
A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealin...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; fre |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | RAJENDRAN, Hari Prasath BREZOCZKY, Thomas SATYAVOLU, Nitin Bharadwaj YEDLA, Srinivasa Rao SHIRAHATTI, Lakshmikanth Krishnamurthy SAVANDAIAH, Kirankumar Neelasandra MILLER, Keith A |
description | A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealing, and/or polishing processes. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed thereon. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using a bellows assembly and a chuck sealing surface.
Procédé et appareil de traitement de substrat et outil combiné comprenant un ensemble chambre de transfert et une pluralité d'ensembles de traitement. L'ensemble chambre de transfert et les ensembles de traitement peuvent comprendre des plateformes de traitement pour des procédés d'ALD, de CVD, de PVD, de gravure, de nettoyage, d'implantation, de chauffage, de recuit et/ou de polissage. Les volumes des chambres de traitement sont isolés du volume de la chambre de transfert à l'aide d'un mandrin de support sur lequel un substrat est disposé. Le mandrin de support est soulevé pour former un joint isolant entre le volume de la chambre de traitement et le volume de la chambre de transfert, à l'aide d'un ensemble soufflet et d'une surface d'étanchéité du mandrin. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2021247143A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2021247143A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2021247143A13</originalsourceid><addsrcrecordid>eNrjZHDy8HT3UAhx9Q1wDXIMCQ1yVXD0c1EIc3QODfVV8Az293EM8fT3UwgI8nd2DQ729HNX8PX081Rw9QvzDPL383X1CwnmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGRibmhibGjobGxKkCANqXLIM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI ENVIRONMENTS</title><source>esp@cenet</source><creator>RAJENDRAN, Hari Prasath ; BREZOCZKY, Thomas ; SATYAVOLU, Nitin Bharadwaj ; YEDLA, Srinivasa Rao ; SHIRAHATTI, Lakshmikanth Krishnamurthy ; SAVANDAIAH, Kirankumar Neelasandra ; MILLER, Keith A</creator><creatorcontrib>RAJENDRAN, Hari Prasath ; BREZOCZKY, Thomas ; SATYAVOLU, Nitin Bharadwaj ; YEDLA, Srinivasa Rao ; SHIRAHATTI, Lakshmikanth Krishnamurthy ; SAVANDAIAH, Kirankumar Neelasandra ; MILLER, Keith A</creatorcontrib><description>A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealing, and/or polishing processes. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed thereon. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using a bellows assembly and a chuck sealing surface.
Procédé et appareil de traitement de substrat et outil combiné comprenant un ensemble chambre de transfert et une pluralité d'ensembles de traitement. L'ensemble chambre de transfert et les ensembles de traitement peuvent comprendre des plateformes de traitement pour des procédés d'ALD, de CVD, de PVD, de gravure, de nettoyage, d'implantation, de chauffage, de recuit et/ou de polissage. Les volumes des chambres de traitement sont isolés du volume de la chambre de transfert à l'aide d'un mandrin de support sur lequel un substrat est disposé. Le mandrin de support est soulevé pour former un joint isolant entre le volume de la chambre de traitement et le volume de la chambre de transfert, à l'aide d'un ensemble soufflet et d'une surface d'étanchéité du mandrin.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211209&DB=EPODOC&CC=WO&NR=2021247143A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211209&DB=EPODOC&CC=WO&NR=2021247143A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAJENDRAN, Hari Prasath</creatorcontrib><creatorcontrib>BREZOCZKY, Thomas</creatorcontrib><creatorcontrib>SATYAVOLU, Nitin Bharadwaj</creatorcontrib><creatorcontrib>YEDLA, Srinivasa Rao</creatorcontrib><creatorcontrib>SHIRAHATTI, Lakshmikanth Krishnamurthy</creatorcontrib><creatorcontrib>SAVANDAIAH, Kirankumar Neelasandra</creatorcontrib><creatorcontrib>MILLER, Keith A</creatorcontrib><title>HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI ENVIRONMENTS</title><description>A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealing, and/or polishing processes. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed thereon. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using a bellows assembly and a chuck sealing surface.
Procédé et appareil de traitement de substrat et outil combiné comprenant un ensemble chambre de transfert et une pluralité d'ensembles de traitement. L'ensemble chambre de transfert et les ensembles de traitement peuvent comprendre des plateformes de traitement pour des procédés d'ALD, de CVD, de PVD, de gravure, de nettoyage, d'implantation, de chauffage, de recuit et/ou de polissage. Les volumes des chambres de traitement sont isolés du volume de la chambre de transfert à l'aide d'un mandrin de support sur lequel un substrat est disposé. Le mandrin de support est soulevé pour former un joint isolant entre le volume de la chambre de traitement et le volume de la chambre de transfert, à l'aide d'un ensemble soufflet et d'une surface d'étanchéité du mandrin.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDy8HT3UAhx9Q1wDXIMCQ1yVXD0c1EIc3QODfVV8Az293EM8fT3UwgI8nd2DQ729HNX8PX081Rw9QvzDPL383X1CwnmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGRibmhibGjobGxKkCANqXLIM</recordid><startdate>20211209</startdate><enddate>20211209</enddate><creator>RAJENDRAN, Hari Prasath</creator><creator>BREZOCZKY, Thomas</creator><creator>SATYAVOLU, Nitin Bharadwaj</creator><creator>YEDLA, Srinivasa Rao</creator><creator>SHIRAHATTI, Lakshmikanth Krishnamurthy</creator><creator>SAVANDAIAH, Kirankumar Neelasandra</creator><creator>MILLER, Keith A</creator><scope>EVB</scope></search><sort><creationdate>20211209</creationdate><title>HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI ENVIRONMENTS</title><author>RAJENDRAN, Hari Prasath ; BREZOCZKY, Thomas ; SATYAVOLU, Nitin Bharadwaj ; YEDLA, Srinivasa Rao ; SHIRAHATTI, Lakshmikanth Krishnamurthy ; SAVANDAIAH, Kirankumar Neelasandra ; MILLER, Keith A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021247143A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>RAJENDRAN, Hari Prasath</creatorcontrib><creatorcontrib>BREZOCZKY, Thomas</creatorcontrib><creatorcontrib>SATYAVOLU, Nitin Bharadwaj</creatorcontrib><creatorcontrib>YEDLA, Srinivasa Rao</creatorcontrib><creatorcontrib>SHIRAHATTI, Lakshmikanth Krishnamurthy</creatorcontrib><creatorcontrib>SAVANDAIAH, Kirankumar Neelasandra</creatorcontrib><creatorcontrib>MILLER, Keith A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAJENDRAN, Hari Prasath</au><au>BREZOCZKY, Thomas</au><au>SATYAVOLU, Nitin Bharadwaj</au><au>YEDLA, Srinivasa Rao</au><au>SHIRAHATTI, Lakshmikanth Krishnamurthy</au><au>SAVANDAIAH, Kirankumar Neelasandra</au><au>MILLER, Keith A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI ENVIRONMENTS</title><date>2021-12-09</date><risdate>2021</risdate><abstract>A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. The transfer chamber assembly and processing assemblies may include processing platforms for ALD, CVD, PVD, etch, cleaning, implanting, heating, annealing, and/or polishing processes. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed thereon. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using a bellows assembly and a chuck sealing surface.
Procédé et appareil de traitement de substrat et outil combiné comprenant un ensemble chambre de transfert et une pluralité d'ensembles de traitement. L'ensemble chambre de transfert et les ensembles de traitement peuvent comprendre des plateformes de traitement pour des procédés d'ALD, de CVD, de PVD, de gravure, de nettoyage, d'implantation, de chauffage, de recuit et/ou de polissage. Les volumes des chambres de traitement sont isolés du volume de la chambre de transfert à l'aide d'un mandrin de support sur lequel un substrat est disposé. Le mandrin de support est soulevé pour former un joint isolant entre le volume de la chambre de traitement et le volume de la chambre de transfert, à l'aide d'un ensemble soufflet et d'une surface d'étanchéité du mandrin.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng ; fre |
recordid | cdi_epo_espacenet_WO2021247143A1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | HIGH TEMPERATURE AND VACUUM ISOLATION PROCESSING MINI ENVIRONMENTS |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T12%3A00%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RAJENDRAN,%20Hari%20Prasath&rft.date=2021-12-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2021247143A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |