SEMICONDUCTOR MANUFACTURING METHOD AND MULTI-PIECE DEPOSITION DEVICE

Provided are a semiconductor manufacturing method and a multi-piece deposition device. The semiconductor manufacturing method comprises: performing a first deposition process on a substrate (110) of a multi-piece deposition device (100); taking out the substrate (110) after the first deposition proc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DUAN, Xiankun, REN, Ruochen, TSENG, Hsiang-Tung
Format:	Patent
Sprache:	chi ; eng ; fre
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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