ELECTRONIC CIRCUIT
The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one...
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| creator | RAGONNEAU, Marc BELNOUE, Olivier VINCENT, Jacques ROLLIN, Pascal DUFFAUD, Bertrand |
| description | The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).
La présente invention concerne un circuit électronique (1) comprenant une pluralité de circuits imprimés (2) reliés par au moins une barre-bus (4), chaque circuit imprimé (2) comprenant au moins deux couches superposées enserrant au moins une portion de ladite au moins une barre-bus (4), de sorte à enterrer ladite au moins une barre-bus (4). |
| format | Patent |
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La présente invention concerne un circuit électronique (1) comprenant une pluralité de circuits imprimés (2) reliés par au moins une barre-bus (4), chaque circuit imprimé (2) comprenant au moins deux couches superposées enserrant au moins une portion de ladite au moins une barre-bus (4), de sorte à enterrer ladite au moins une barre-bus (4).</description><language>eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211007&DB=EPODOC&CC=WO&NR=2021198625A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20211007&DB=EPODOC&CC=WO&NR=2021198625A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAGONNEAU, Marc</creatorcontrib><creatorcontrib>BELNOUE, Olivier</creatorcontrib><creatorcontrib>VINCENT, Jacques</creatorcontrib><creatorcontrib>ROLLIN, Pascal</creatorcontrib><creatorcontrib>DUFFAUD, Bertrand</creatorcontrib><title>ELECTRONIC CIRCUIT</title><description>The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).
La présente invention concerne un circuit électronique (1) comprenant une pluralité de circuits imprimés (2) reliés par au moins une barre-bus (4), chaque circuit imprimé (2) comprenant au moins deux couches superposées enserrant au moins une portion de ladite au moins une barre-bus (4), de sorte à enterrer ladite au moins une barre-bus (4).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBy9XF1Dgny9_N0VnD2DHIO9QzhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGhpYWZkamjobGxKkCALp2Hww</recordid><startdate>20211007</startdate><enddate>20211007</enddate><creator>RAGONNEAU, Marc</creator><creator>BELNOUE, Olivier</creator><creator>VINCENT, Jacques</creator><creator>ROLLIN, Pascal</creator><creator>DUFFAUD, Bertrand</creator><scope>EVB</scope></search><sort><creationdate>20211007</creationdate><title>ELECTRONIC CIRCUIT</title><author>RAGONNEAU, Marc ; BELNOUE, Olivier ; VINCENT, Jacques ; ROLLIN, Pascal ; DUFFAUD, Bertrand</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021198625A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>RAGONNEAU, Marc</creatorcontrib><creatorcontrib>BELNOUE, Olivier</creatorcontrib><creatorcontrib>VINCENT, Jacques</creatorcontrib><creatorcontrib>ROLLIN, Pascal</creatorcontrib><creatorcontrib>DUFFAUD, Bertrand</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAGONNEAU, Marc</au><au>BELNOUE, Olivier</au><au>VINCENT, Jacques</au><au>ROLLIN, Pascal</au><au>DUFFAUD, Bertrand</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC CIRCUIT</title><date>2021-10-07</date><risdate>2021</risdate><abstract>The invention relates to an electronic circuit (1) comprising a plurality of printed circuits (2) connected by at least one bus bar (4), each printed circuit (2) comprising at least two superposed layers enclosing at least a portion of said at least one bus bar (4), so as to cover said at least one bus bar (4).
La présente invention concerne un circuit électronique (1) comprenant une pluralité de circuits imprimés (2) reliés par au moins une barre-bus (4), chaque circuit imprimé (2) comprenant au moins deux couches superposées enserrant au moins une portion de ladite au moins une barre-bus (4), de sorte à enterrer ladite au moins une barre-bus (4).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | ELECTRONIC CIRCUIT |
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