ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME
The present invention relates to an adhesive composition, and a coverlay film and a printed circuit board that include same. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber. La présente invention...
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| creator | CHAE, Dongho PARK, Kwangseok JEONG, Inki PARK, Subyung RYU, Euidock |
| description | The present invention relates to an adhesive composition, and a coverlay film and a printed circuit board that include same. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber.
La présente invention concerne une composition adhésive, et un film de revêtement et une carte de circuit imprimé les comprenant. La composition adhésive comprend : (a) une résine époxy ; et (b) une résine liante comprenant du caoutchouc polybutadiène époxydé et au moins deux types de caoutchouc.
본 발명은 접착 조성물 및 이를 포함하는 커버레이 필름 및 인쇄회로기판에 관한 것으로서, 상기 접착 조성물은 (a) 에폭시 수지; 및 (b) 에폭시화 폴리부타디엔 고무, 및 2종 이상의 고무를 함유하는 바인더 수지;를 포함한다. |
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La présente invention concerne une composition adhésive, et un film de revêtement et une carte de circuit imprimé les comprenant. La composition adhésive comprend : (a) une résine époxy ; et (b) une résine liante comprenant du caoutchouc polybutadiène époxydé et au moins deux types de caoutchouc.
본 발명은 접착 조성물 및 이를 포함하는 커버레이 필름 및 인쇄회로기판에 관한 것으로서, 상기 접착 조성물은 (a) 에폭시 수지; 및 (b) 에폭시화 폴리부타디엔 고무, 및 2종 이상의 고무를 함유하는 바인더 수지;를 포함한다.</description><language>eng ; fre ; kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210916&DB=EPODOC&CC=WO&NR=2021182910A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210916&DB=EPODOC&CC=WO&NR=2021182910A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHAE, Dongho</creatorcontrib><creatorcontrib>PARK, Kwangseok</creatorcontrib><creatorcontrib>JEONG, Inki</creatorcontrib><creatorcontrib>PARK, Subyung</creatorcontrib><creatorcontrib>RYU, Euidock</creatorcontrib><title>ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME</title><description>The present invention relates to an adhesive composition, and a coverlay film and a printed circuit board that include same. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber.
La présente invention concerne une composition adhésive, et un film de revêtement et une carte de circuit imprimé les comprenant. La composition adhésive comprend : (a) une résine époxy ; et (b) une résine liante comprenant du caoutchouc polybutadiène époxydé et au moins deux types de caoutchouc.
본 발명은 접착 조성물 및 이를 포함하는 커버레이 필름 및 인쇄회로기판에 관한 것으로서, 상기 접착 조성물은 (a) 에폭시 수지; 및 (b) 에폭시화 폴리부타디엔 고무, 및 2종 이상의 고무를 함유하는 바인더 수지;를 포함한다.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhydPFwDfYMc1Vw9vcN8A8O8fT301Fw9HMB8sNcg3wcIxXcPH18wSIBQZ5-Ia5AGc8g51DPEAUnf8cgF4UQD8cQBU8_Z59QF1eFYEdfVx4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh_ub2RgZGhoYWRpaOBoaEycKgBkKDAc</recordid><startdate>20210916</startdate><enddate>20210916</enddate><creator>CHAE, Dongho</creator><creator>PARK, Kwangseok</creator><creator>JEONG, Inki</creator><creator>PARK, Subyung</creator><creator>RYU, Euidock</creator><scope>EVB</scope></search><sort><creationdate>20210916</creationdate><title>ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME</title><author>CHAE, Dongho ; PARK, Kwangseok ; JEONG, Inki ; PARK, Subyung ; RYU, Euidock</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021182910A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; kor</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHAE, Dongho</creatorcontrib><creatorcontrib>PARK, Kwangseok</creatorcontrib><creatorcontrib>JEONG, Inki</creatorcontrib><creatorcontrib>PARK, Subyung</creatorcontrib><creatorcontrib>RYU, Euidock</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHAE, Dongho</au><au>PARK, Kwangseok</au><au>JEONG, Inki</au><au>PARK, Subyung</au><au>RYU, Euidock</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME</title><date>2021-09-16</date><risdate>2021</risdate><abstract>The present invention relates to an adhesive composition, and a coverlay film and a printed circuit board that include same. The adhesive composition includes: (a) an epoxy resin; and (b) a binder resin including epoxidized polybutadiene rubber and at least two kinds of rubber.
La présente invention concerne une composition adhésive, et un film de revêtement et une carte de circuit imprimé les comprenant. La composition adhésive comprend : (a) une résine époxy ; et (b) une résine liante comprenant du caoutchouc polybutadiène époxydé et au moins deux types de caoutchouc.
본 발명은 접착 조성물 및 이를 포함하는 커버레이 필름 및 인쇄회로기판에 관한 것으로서, 상기 접착 조성물은 (a) 에폭시 수지; 및 (b) 에폭시화 폴리부타디엔 고무, 및 2종 이상의 고무를 함유하는 바인더 수지;를 포함한다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSTION, AND COVERLAY FILM AND PRINTED CIRCUIT BOARD THAT INCLUDE SAME |
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