CURABLE COMPOSITION, AND DRY FILM AND CURED OBJECT OBTAINED THEREFROM

[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F stru...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUKUDA Shinichiro, CHA Haneul
Format: Patent
Sprache:eng ; fre ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!