CURABLE COMPOSITION, AND DRY FILM AND CURED OBJECT OBTAINED THEREFROM
[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F stru...
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| creator | FUKUDA Shinichiro CHA Haneul |
| description | [Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F structure, and a urethane structure, (B) a photopolymerization initiator, and (C) an epoxy resin having an isocyanurate structure, wherein the epoxy resin (C) having an isocyanurate structure has a structure in which a nitrogen atom contained in the isocyanurate structure has been bonded to an epoxy group by an alkylene chain having two or more carbon atoms. [Selected drawing] None
Le problème décrit par la présente invention est de fournir une composition durcissable capable de former des réserves de soudure qui combinent une résistance au flux et une endurance au pliage. La solution selon l'invention porte sur une composition durcissable qui comprend (A) une résine soluble dans les alcalins ayant au moins une structure choisie parmi une structure de bisphénol A, une structure de bisphénol F et une structure d'uréthane, (B) un initiateur de photopolymérisation, et (C) une résine époxy ayant une structure isocyanurate, la résine époxy (C) qui a une structure isocyanurate ayant une structure dans laquelle un atome d'azote contenu dans la structure isocyanurate a été lié à un groupe époxy par une chaîne alkylène ayant deux atomes de carbone ou plus. Aucun dessin sélectionné
［課題］フラックス耐性および折り曲げ性を兼ね備えたソルダーレジストを形成し得る硬化性組成物を提供すること。 ［手段］ （Ａ）ビスフェノールＡ構造、ビスフェノールＦ構造およびウレタン構造のうち少なくともいずれか１つの構造を有するアルカリ可溶性樹脂と、（Ｂ）光重合開始剤と、（Ｃ）イソシアヌレート構造を有するエポキシ樹脂とを含有する硬化性組成物であって、前記（Ｃ）イソシアヌレート構造を有するエポキシ樹脂が、そのイソシアヌレート構造中の窒素原子とエポキシ基との間が炭素数２以上のアルキレン鎖により結合された構造を有する、前記硬化性組成物。 ［選択図］なし |
| format | Patent |
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Le problème décrit par la présente invention est de fournir une composition durcissable capable de former des réserves de soudure qui combinent une résistance au flux et une endurance au pliage. La solution selon l'invention porte sur une composition durcissable qui comprend (A) une résine soluble dans les alcalins ayant au moins une structure choisie parmi une structure de bisphénol A, une structure de bisphénol F et une structure d'uréthane, (B) un initiateur de photopolymérisation, et (C) une résine époxy ayant une structure isocyanurate, la résine époxy (C) qui a une structure isocyanurate ayant une structure dans laquelle un atome d'azote contenu dans la structure isocyanurate a été lié à un groupe époxy par une chaîne alkylène ayant deux atomes de carbone ou plus. Aucun dessin sélectionné
［課題］フラックス耐性および折り曲げ性を兼ね備えたソルダーレジストを形成し得る硬化性組成物を提供すること。 ［手段］ （Ａ）ビスフェノールＡ構造、ビスフェノールＦ構造およびウレタン構造のうち少なくともいずれか１つの構造を有するアルカリ可溶性樹脂と、（Ｂ）光重合開始剤と、（Ｃ）イソシアヌレート構造を有するエポキシ樹脂とを含有する硬化性組成物であって、前記（Ｃ）イソシアヌレート構造を有するエポキシ樹脂が、そのイソシアヌレート構造中の窒素原子とエポキシ基との間が炭素数２以上のアルキレン鎖により結合された構造を有する、前記硬化性組成物。 ［選択図］なし</description><language>eng ; fre ; jpn</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210812&DB=EPODOC&CC=WO&NR=2021157282A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210812&DB=EPODOC&CC=WO&NR=2021157282A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUKUDA Shinichiro</creatorcontrib><creatorcontrib>CHA Haneul</creatorcontrib><title>CURABLE COMPOSITION, AND DRY FILM AND CURED OBJECT OBTAINED THEREFROM</title><description>[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F structure, and a urethane structure, (B) a photopolymerization initiator, and (C) an epoxy resin having an isocyanurate structure, wherein the epoxy resin (C) having an isocyanurate structure has a structure in which a nitrogen atom contained in the isocyanurate structure has been bonded to an epoxy group by an alkylene chain having two or more carbon atoms. [Selected drawing] None
Le problème décrit par la présente invention est de fournir une composition durcissable capable de former des réserves de soudure qui combinent une résistance au flux et une endurance au pliage. La solution selon l'invention porte sur une composition durcissable qui comprend (A) une résine soluble dans les alcalins ayant au moins une structure choisie parmi une structure de bisphénol A, une structure de bisphénol F et une structure d'uréthane, (B) un initiateur de photopolymérisation, et (C) une résine époxy ayant une structure isocyanurate, la résine époxy (C) qui a une structure isocyanurate ayant une structure dans laquelle un atome d'azote contenu dans la structure isocyanurate a été lié à un groupe époxy par une chaîne alkylène ayant deux atomes de carbone ou plus. Aucun dessin sélectionné
［課題］フラックス耐性および折り曲げ性を兼ね備えたソルダーレジストを形成し得る硬化性組成物を提供すること。 ［手段］ （Ａ）ビスフェノールＡ構造、ビスフェノールＦ構造およびウレタン構造のうち少なくともいずれか１つの構造を有するアルカリ可溶性樹脂と、（Ｂ）光重合開始剤と、（Ｃ）イソシアヌレート構造を有するエポキシ樹脂とを含有する硬化性組成物であって、前記（Ｃ）イソシアヌレート構造を有するエポキシ樹脂が、そのイソシアヌレート構造中の窒素原子とエポキシ基との間が炭素数２以上のアルキレン鎖により結合された構造を有する、前記硬化性組成物。 ［選択図］なし</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1Dg1ydPJxVXD29w3wD_YM8fT301Fw9HNRcAmKVHDz9PEFc4CqXF0U_J28XJ1DgFSIo6cfkB_i4Rrk6hbk78vDwJqWmFOcyguluRmU3VxDnD10Uwvy41OLCxKTU_NSS-LD_Y0MjAwNTc2NLIwcDY2JUwUAARMsjw</recordid><startdate>20210812</startdate><enddate>20210812</enddate><creator>FUKUDA Shinichiro</creator><creator>CHA Haneul</creator><scope>EVB</scope></search><sort><creationdate>20210812</creationdate><title>CURABLE COMPOSITION, AND DRY FILM AND CURED OBJECT OBTAINED THEREFROM</title><author>FUKUDA Shinichiro ; CHA Haneul</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021157282A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2021</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>FUKUDA Shinichiro</creatorcontrib><creatorcontrib>CHA Haneul</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUKUDA Shinichiro</au><au>CHA Haneul</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURABLE COMPOSITION, AND DRY FILM AND CURED OBJECT OBTAINED THEREFROM</title><date>2021-08-12</date><risdate>2021</risdate><abstract>[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F structure, and a urethane structure, (B) a photopolymerization initiator, and (C) an epoxy resin having an isocyanurate structure, wherein the epoxy resin (C) having an isocyanurate structure has a structure in which a nitrogen atom contained in the isocyanurate structure has been bonded to an epoxy group by an alkylene chain having two or more carbon atoms. [Selected drawing] None
Le problème décrit par la présente invention est de fournir une composition durcissable capable de former des réserves de soudure qui combinent une résistance au flux et une endurance au pliage. La solution selon l'invention porte sur une composition durcissable qui comprend (A) une résine soluble dans les alcalins ayant au moins une structure choisie parmi une structure de bisphénol A, une structure de bisphénol F et une structure d'uréthane, (B) un initiateur de photopolymérisation, et (C) une résine époxy ayant une structure isocyanurate, la résine époxy (C) qui a une structure isocyanurate ayant une structure dans laquelle un atome d'azote contenu dans la structure isocyanurate a été lié à un groupe époxy par une chaîne alkylène ayant deux atomes de carbone ou plus. Aucun dessin sélectionné
［課題］フラックス耐性および折り曲げ性を兼ね備えたソルダーレジストを形成し得る硬化性組成物を提供すること。 ［手段］ （Ａ）ビスフェノールＡ構造、ビスフェノールＦ構造およびウレタン構造のうち少なくともいずれか１つの構造を有するアルカリ可溶性樹脂と、（Ｂ）光重合開始剤と、（Ｃ）イソシアヌレート構造を有するエポキシ樹脂とを含有する硬化性組成物であって、前記（Ｃ）イソシアヌレート構造を有するエポキシ樹脂が、そのイソシアヌレート構造中の窒素原子とエポキシ基との間が炭素数２以上のアルキレン鎖により結合された構造を有する、前記硬化性組成物。 ［選択図］なし</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | CURABLE COMPOSITION, AND DRY FILM AND CURED OBJECT OBTAINED THEREFROM |
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