MULTI-LAYER PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

A multi-layer printed circuit board comprising a plurality of conductive layers formed of a conductive material, the plurality of conductive layers including at least one intermediate conductive layer formed inside the multilayer print substrate. In at least a part of the intermediate conductive lay...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TSUJI, Yuito, WAKABAYASHI, Minoru, MAKI, Yosuke
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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