ADHESIVE FILM, LAMINATE, AND PRINTED WIRING BOARD

[Problem] To provide an adhesive film that has high adhesiveness with respect to metal substrates and resin substrates such as polyimides, that enables a high solder heat resistance to be achieved, and that provides excellent film handling ability and low-dielectric characteristics. [Solution] An ad...

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Bibliographische Detailangaben
Hauptverfasser:	KOYANAGI Hideyuki, SONODA Ryo, KAWAKUSU Tetsuo, IRISAWA Hayato
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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