FILM-FORMING METHOD AND FILM-FORMING APPARATUS

The present invention comprises: installing, inside a film-forming chamber (2a), at least a vapor deposition material and substrates (S); supplying a gas that does not change the composition of exhaust gas and/or the vapor deposition material to establish, for a first region (A) that includes the su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUROTANI, Hiroshi, OHTAKI, Yoshiyuki, MIYAUCHI, Mitsuhiro, HASEGAWA, Tomokazu, MATSUDAIRA, Takayuki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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