DECORATION ASSEMBLY, HOUSING ASSEMBLY, AND ELECTRONIC DEVICE
The present application provides a decoration assembly, a housing assembly, and an electronic device. The decoration assembly comprises a decoration member, a first adhesive layer, a cover plate, and a waterproof air-permeable film; the decoration member comprises a base and a decoration ring; the b...
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| creator | LI, Shizhe ZOU, Mengruo |
| description | The present application provides a decoration assembly, a housing assembly, and an electronic device. The decoration assembly comprises a decoration member, a first adhesive layer, a cover plate, and a waterproof air-permeable film; the decoration member comprises a base and a decoration ring; the base comprises a first surface and a second surface provided opposite to each other; the decoration ring is convexly provided on the peripheral edge of the first surface, and the base is provided with an air-permeable space; the air-permeable space extends from the first surface to the second surface; the air-permeable space is located on the inner side of the decoration ring; the first adhesive layer is located on the inner side of the decoration ring and is fixedly connected to the first surface; the first adhesive layer forms a first passage in communication with the air-permeable space; the cover plate is fixedly connected to the surface of the first adhesive layer facing away from the base; a first gap is forme |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2021052090A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2021052090A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2021052090A13</originalsourceid><addsrcrecordid>eNrjZLBxcXX2D3IM8fT3U3AMDnb1dfKJ1FHw8A8N9vRzRxJx9HNRcPVxdQ4J8vfzdFZwcQ3zdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGBqZGBpYGjobGxKkCAJ5HKkU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DECORATION ASSEMBLY, HOUSING ASSEMBLY, AND ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>LI, Shizhe ; ZOU, Mengruo</creator><creatorcontrib>LI, Shizhe ; ZOU, Mengruo</creatorcontrib><description>The present application provides a decoration assembly, a housing assembly, and an electronic device. The decoration assembly comprises a decoration member, a first adhesive layer, a cover plate, and a waterproof air-permeable film; the decoration member comprises a base and a decoration ring; the base comprises a first surface and a second surface provided opposite to each other; the decoration ring is convexly provided on the peripheral edge of the first surface, and the base is provided with an air-permeable space; the air-permeable space extends from the first surface to the second surface; the air-permeable space is located on the inner side of the decoration ring; the first adhesive layer is located on the inner side of the decoration ring and is fixedly connected to the first surface; the first adhesive layer forms a first passage in communication with the air-permeable space; the cover plate is fixedly connected to the surface of the first adhesive layer facing away from the base; a first gap is forme</description><language>chi ; eng ; fre</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210325&DB=EPODOC&CC=WO&NR=2021052090A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210325&DB=EPODOC&CC=WO&NR=2021052090A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LI, Shizhe</creatorcontrib><creatorcontrib>ZOU, Mengruo</creatorcontrib><title>DECORATION ASSEMBLY, HOUSING ASSEMBLY, AND ELECTRONIC DEVICE</title><description>The present application provides a decoration assembly, a housing assembly, and an electronic device. The decoration assembly comprises a decoration member, a first adhesive layer, a cover plate, and a waterproof air-permeable film; the decoration member comprises a base and a decoration ring; the base comprises a first surface and a second surface provided opposite to each other; the decoration ring is convexly provided on the peripheral edge of the first surface, and the base is provided with an air-permeable space; the air-permeable space extends from the first surface to the second surface; the air-permeable space is located on the inner side of the decoration ring; the first adhesive layer is located on the inner side of the decoration ring and is fixedly connected to the first surface; the first adhesive layer forms a first passage in communication with the air-permeable space; the cover plate is fixedly connected to the surface of the first adhesive layer facing away from the base; a first gap is forme</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBxcXX2D3IM8fT3U3AMDnb1dfKJ1FHw8A8N9vRzRxJx9HNRcPVxdQ4J8vfzdFZwcQ3zdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGBqZGBpYGjobGxKkCAJ5HKkU</recordid><startdate>20210325</startdate><enddate>20210325</enddate><creator>LI, Shizhe</creator><creator>ZOU, Mengruo</creator><scope>EVB</scope></search><sort><creationdate>20210325</creationdate><title>DECORATION ASSEMBLY, HOUSING ASSEMBLY, AND ELECTRONIC DEVICE</title><author>LI, Shizhe ; ZOU, Mengruo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021052090A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng ; fre</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>LI, Shizhe</creatorcontrib><creatorcontrib>ZOU, Mengruo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LI, Shizhe</au><au>ZOU, Mengruo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DECORATION ASSEMBLY, HOUSING ASSEMBLY, AND ELECTRONIC DEVICE</title><date>2021-03-25</date><risdate>2021</risdate><abstract>The present application provides a decoration assembly, a housing assembly, and an electronic device. The decoration assembly comprises a decoration member, a first adhesive layer, a cover plate, and a waterproof air-permeable film; the decoration member comprises a base and a decoration ring; the base comprises a first surface and a second surface provided opposite to each other; the decoration ring is convexly provided on the peripheral edge of the first surface, and the base is provided with an air-permeable space; the air-permeable space extends from the first surface to the second surface; the air-permeable space is located on the inner side of the decoration ring; the first adhesive layer is located on the inner side of the decoration ring and is fixedly connected to the first surface; the first adhesive layer forms a first passage in communication with the air-permeable space; the cover plate is fixedly connected to the surface of the first adhesive layer facing away from the base; a first gap is forme</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng ; fre |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | DECORATION ASSEMBLY, HOUSING ASSEMBLY, AND ELECTRONIC DEVICE |
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