POLISHING HEAD WITH MEMBRANE POSITION CONTROL
A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly beneath the housing with a space between the housing and the membrane assembly defining a pressurizable chamber, and a sensor in the housing configured to measure a distance from...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | GURUSAMY, Jay ZUNIGA, Steven |
| description | A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly beneath the housing with a space between the housing and the membrane assembly defining a pressurizable chamber, and a sensor in the housing configured to measure a distance from the sensor to the membrane assembly.
Une tête de support pour le polissage chimico-mécanique comprend un boîtier destiné à être fixé à un arbre d'entraînement, un ensemble membrane situé sous le boîtier avec un espace entre le boîtier et l'ensemble membrane définissant une chambre pouvant être mise sous pression, et un capteur situé dans le boîtier configuré pour mesurer une distance du capteur à l'ensemble membrane. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2021035077A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2021035077A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2021035077A13</originalsourceid><addsrcrecordid>eNrjZNAN8PfxDPbw9HNX8HB1dFEI9wzxUPB19XUKcvRzVQjwD_YM8fT3U3D29wsJ8vfhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGBsamBubmjobGxKkCAFthJnI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING HEAD WITH MEMBRANE POSITION CONTROL</title><source>esp@cenet</source><creator>GURUSAMY, Jay ; ZUNIGA, Steven</creator><creatorcontrib>GURUSAMY, Jay ; ZUNIGA, Steven</creatorcontrib><description>A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly beneath the housing with a space between the housing and the membrane assembly defining a pressurizable chamber, and a sensor in the housing configured to measure a distance from the sensor to the membrane assembly.
Une tête de support pour le polissage chimico-mécanique comprend un boîtier destiné à être fixé à un arbre d'entraînement, un ensemble membrane situé sous le boîtier avec un espace entre le boîtier et l'ensemble membrane définissant une chambre pouvant être mise sous pression, et un capteur situé dans le boîtier configuré pour mesurer une distance du capteur à l'ensemble membrane.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210225&DB=EPODOC&CC=WO&NR=2021035077A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210225&DB=EPODOC&CC=WO&NR=2021035077A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GURUSAMY, Jay</creatorcontrib><creatorcontrib>ZUNIGA, Steven</creatorcontrib><title>POLISHING HEAD WITH MEMBRANE POSITION CONTROL</title><description>A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly beneath the housing with a space between the housing and the membrane assembly defining a pressurizable chamber, and a sensor in the housing configured to measure a distance from the sensor to the membrane assembly.
Une tête de support pour le polissage chimico-mécanique comprend un boîtier destiné à être fixé à un arbre d'entraînement, un ensemble membrane situé sous le boîtier avec un espace entre le boîtier et l'ensemble membrane définissant une chambre pouvant être mise sous pression, et un capteur situé dans le boîtier configuré pour mesurer une distance du capteur à l'ensemble membrane.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAN8PfxDPbw9HNX8HB1dFEI9wzxUPB19XUKcvRzVQjwD_YM8fT3U3D29wsJ8vfhYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx4f5GBkaGBsamBubmjobGxKkCAFthJnI</recordid><startdate>20210225</startdate><enddate>20210225</enddate><creator>GURUSAMY, Jay</creator><creator>ZUNIGA, Steven</creator><scope>EVB</scope></search><sort><creationdate>20210225</creationdate><title>POLISHING HEAD WITH MEMBRANE POSITION CONTROL</title><author>GURUSAMY, Jay ; ZUNIGA, Steven</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2021035077A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>GURUSAMY, Jay</creatorcontrib><creatorcontrib>ZUNIGA, Steven</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GURUSAMY, Jay</au><au>ZUNIGA, Steven</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING HEAD WITH MEMBRANE POSITION CONTROL</title><date>2021-02-25</date><risdate>2021</risdate><abstract>A carrier head for chemical mechanical polishing includes a housing for attachment to a drive shaft, a membrane assembly beneath the housing with a space between the housing and the membrane assembly defining a pressurizable chamber, and a sensor in the housing configured to measure a distance from the sensor to the membrane assembly.
Une tête de support pour le polissage chimico-mécanique comprend un boîtier destiné à être fixé à un arbre d'entraînement, un ensemble membrane situé sous le boîtier avec un espace entre le boîtier et l'ensemble membrane définissant une chambre pouvant être mise sous pression, et un capteur situé dans le boîtier configuré pour mesurer une distance du capteur à l'ensemble membrane.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre |
| recordid | cdi_epo_espacenet_WO2021035077A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | POLISHING HEAD WITH MEMBRANE POSITION CONTROL |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T19%3A35%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GURUSAMY,%20Jay&rft.date=2021-02-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EWO2021035077A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |