RETURN PATH CAVITY FOR SINGLE ENDED SIGNAL VIA
A substrate largely or entirely devoid of return current vias is disclosed. The substrate may include a first signal layer, a ground plane, a power plane and a second signal layer, each separated by a dielectric material. The ground plane and power plane together form a capacitor providing a return...
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| creator | HUDDAR, Vinod Arjun |
| description | A substrate largely or entirely devoid of return current vias is disclosed. The substrate may include a first signal layer, a ground plane, a power plane and a second signal layer, each separated by a dielectric material. The ground plane and power plane together form a capacitor providing a return current path for the current in the signal layers.
L'invention concerne un substrat largement ou entièrement dépourvu de trous d'interconnexion à courant de retour. Le substrat peut comprendre une première couche de signal, un plan de masse, un plan de puissance et une seconde couche de signal, chacun séparé par un matériau diélectrique. Le plan de masse et le plan de puissance forment ensemble un condensateur fournissant un trajet de courant de retour pour le courant dans les couches de signal. |
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L'invention concerne un substrat largement ou entièrement dépourvu de trous d'interconnexion à courant de retour. Le substrat peut comprendre une première couche de signal, un plan de masse, un plan de puissance et une seconde couche de signal, chacun séparé par un matériau diélectrique. Le plan de masse et le plan de puissance forment ensemble un condensateur fournissant un trajet de courant de retour pour le courant dans les couches de signal.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201224&DB=EPODOC&CC=WO&NR=2020256774A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201224&DB=EPODOC&CC=WO&NR=2020256774A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUDDAR, Vinod Arjun</creatorcontrib><title>RETURN PATH CAVITY FOR SINGLE ENDED SIGNAL VIA</title><description>A substrate largely or entirely devoid of return current vias is disclosed. The substrate may include a first signal layer, a ground plane, a power plane and a second signal layer, each separated by a dielectric material. The ground plane and power plane together form a capacitor providing a return current path for the current in the signal layers.
L'invention concerne un substrat largement ou entièrement dépourvu de trous d'interconnexion à courant de retour. Le substrat peut comprendre une première couche de signal, un plan de masse, un plan de puissance et une seconde couche de signal, chacun séparé par un matériau diélectrique. Le plan de masse et le plan de puissance forment ensemble un condensateur fournissant un trajet de courant de retour pour le courant dans les couches de signal.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNALcg0JDfJTCHAM8VBwdgzzDIlUcPMPUgj29HP3cVVw9XNxdQFy3P0cfRTCPB15GFjTEnOKU3mhNDeDsptriLOHbmpBfnxqcUFicmpeakl8uL-RARCampmbmzgaGhOnCgBi0SZv</recordid><startdate>20201224</startdate><enddate>20201224</enddate><creator>HUDDAR, Vinod Arjun</creator><scope>EVB</scope></search><sort><creationdate>20201224</creationdate><title>RETURN PATH CAVITY FOR SINGLE ENDED SIGNAL VIA</title><author>HUDDAR, Vinod Arjun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2020256774A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HUDDAR, Vinod Arjun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUDDAR, Vinod Arjun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RETURN PATH CAVITY FOR SINGLE ENDED SIGNAL VIA</title><date>2020-12-24</date><risdate>2020</risdate><abstract>A substrate largely or entirely devoid of return current vias is disclosed. The substrate may include a first signal layer, a ground plane, a power plane and a second signal layer, each separated by a dielectric material. The ground plane and power plane together form a capacitor providing a return current path for the current in the signal layers.
L'invention concerne un substrat largement ou entièrement dépourvu de trous d'interconnexion à courant de retour. Le substrat peut comprendre une première couche de signal, un plan de masse, un plan de puissance et une seconde couche de signal, chacun séparé par un matériau diélectrique. Le plan de masse et le plan de puissance forment ensemble un condensateur fournissant un trajet de courant de retour pour le courant dans les couches de signal.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | RETURN PATH CAVITY FOR SINGLE ENDED SIGNAL VIA |
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