THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT USING SAME

The present invention relates to a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition comprising (C) 2 to 20 parts by weight of block copolymer comprising polyether segments and polyamide segments relative to 100 parts by weight of a base resin compr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, Hanna, BAN, Kyunha, JIN, Youngsub, BAE, Yunseok
Format: Patent
Sprache:eng ; fre ; kor
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Beschreibung
Zusammenfassung:The present invention relates to a thermoplastic resin composition and a molded product using same, the thermoplastic resin composition comprising (C) 2 to 20 parts by weight of block copolymer comprising polyether segments and polyamide segments relative to 100 parts by weight of a base resin comprising (A) 50 to 80 wt % of polyamide resin and (B) 20 to 50 wt % of fiber reinforcement. La présente invention concerne une composition de résine thermoplastique et un produit moulé l'utilisant, la composition de résine thermoplastique comprenant (C) 2 à 20 parties en poids d'un copolymère séquencé comprenant des segments polyéther et des segments polyamide par rapport à 100 parties en poids d'une résine de base comprenant (A) 50 à 80 % en poids de résine polyamide et (B) 20 à 50 % en poids de renfort fibreux. (A) 폴리아미드 수지 50 내지 80 중량%; 및 (B) 섬유 보강재 20 내지 50 중량%을 포함하는 기초수지 100 중량부에 대하여, (C) 폴리에테르 세그먼트와 폴리아미드 세그먼트를 포함하는 블록 공중합체 2 내지 20 중량부를 포함하는 열가소성 수지 조성물 및 이를 이용한 성형품에 관한 것이다.