FILM FORMATION METHOD AND FILM FORMATION DEVICE

This film formation method has: a step for adsorbing a precursor of a film-forming source gas onto the surface of a substrate by irradiating the inside of a processing container with ultraviolet light which has a first wavelength and separates a predetermined bonding of the source gas while supplyin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	IFUKU, Ryota, AITA, Michitaka, ITABASHI, Ken, KATOU, Takaaki, YAMADA, Kazuki
Format:	Patent
Sprache:	eng ; fre ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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