CONDUCTIVE FILM FORMATION
A method of forming a conductive film. The method includes applying an ink onto a substrate. The ink includes a plurality of nanostructures formed from an electrically-conductive material and a polymer binder. The method includes drying the ink on the substrate. The method includes applying an overc...
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creator | ALLEMAND, Pierre-Marc DAI, Haixia SPAID, Michael |
description | A method of forming a conductive film. The method includes applying an ink onto a substrate. The ink includes a plurality of nanostructures formed from an electrically-conductive material and a polymer binder. The method includes drying the ink on the substrate. The method includes applying an overcoat material solution onto the dried ink. The overcoat solution includes at least some solvent suitable to provide at least some solubility of the binder. Also, a conductive film that includes a substrate, a matrix on the substrate, and a plurality of nanostructures within the matrix. The matrix is provided as a resultant of a polymer binder present within an ink that carried the nanostructures that was applied and dried upon the substrate, a dried/cured overcoat material that that was applied on the dried ink layer in the form of a coating solution that included a polymer and at least some solvent to provide at least some solubility of the binder, with the binder being at least partially dissolved.
L'invention concerne un procédé de formation d'un film conducteur. Le procédé consiste à appliquer une encre sur un substrat. L'encre comprend une pluralité de nanostructures formées à partir d'un matériau électroconducteur et d'un liant polymère. Le procédé consiste à sécher de l'encre sur le substrat. Le procédé consiste à appliquer une solution de couche de finition sur l'encre séchée. La solution de couche de finition comprend au moins du solvant approprié afin d'obtenir au moins une certaine solubilité du liant. L'invention concerne également un film conducteur qui comprend un substrat, une matrice sur le substrat et une pluralité de nanostructures à l'intérieur de la matrice. La matrice est fournie en tant que résultante d'un liant polymère présent dans une encre qui a transporté les nanostructures qui ont été appliquées et séchées sur le substrat, un matériau de couche de finition séché/durci qui a été appliqué sur la couche d'encre séchée sous forme d'une solution de revêtement qui comprend un polymère et au moins du solvant permettant d'obtenir au moins une certaine solubilité du liant, le liant étant au moins partiellement dissous. |
format | Patent |
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L'invention concerne un procédé de formation d'un film conducteur. Le procédé consiste à appliquer une encre sur un substrat. L'encre comprend une pluralité de nanostructures formées à partir d'un matériau électroconducteur et d'un liant polymère. Le procédé consiste à sécher de l'encre sur le substrat. Le procédé consiste à appliquer une solution de couche de finition sur l'encre séchée. La solution de couche de finition comprend au moins du solvant approprié afin d'obtenir au moins une certaine solubilité du liant. L'invention concerne également un film conducteur qui comprend un substrat, une matrice sur le substrat et une pluralité de nanostructures à l'intérieur de la matrice. La matrice est fournie en tant que résultante d'un liant polymère présent dans une encre qui a transporté les nanostructures qui ont été appliquées et séchées sur le substrat, un matériau de couche de finition séché/durci qui a été appliqué sur la couche d'encre séchée sous forme d'une solution de revêtement qui comprend un polymère et au moins du solvant permettant d'obtenir au moins une certaine solubilité du liant, le liant étant au moins partiellement dissous.</description><language>eng ; fre</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201008&DB=EPODOC&CC=WO&NR=2020205903A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201008&DB=EPODOC&CC=WO&NR=2020205903A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ALLEMAND, Pierre-Marc</creatorcontrib><creatorcontrib>DAI, Haixia</creatorcontrib><creatorcontrib>SPAID, Michael</creatorcontrib><title>CONDUCTIVE FILM FORMATION</title><description>A method of forming a conductive film. The method includes applying an ink onto a substrate. The ink includes a plurality of nanostructures formed from an electrically-conductive material and a polymer binder. The method includes drying the ink on the substrate. The method includes applying an overcoat material solution onto the dried ink. The overcoat solution includes at least some solvent suitable to provide at least some solubility of the binder. Also, a conductive film that includes a substrate, a matrix on the substrate, and a plurality of nanostructures within the matrix. The matrix is provided as a resultant of a polymer binder present within an ink that carried the nanostructures that was applied and dried upon the substrate, a dried/cured overcoat material that that was applied on the dried ink layer in the form of a coating solution that included a polymer and at least some solvent to provide at least some solubility of the binder, with the binder being at least partially dissolved.
L'invention concerne un procédé de formation d'un film conducteur. Le procédé consiste à appliquer une encre sur un substrat. L'encre comprend une pluralité de nanostructures formées à partir d'un matériau électroconducteur et d'un liant polymère. Le procédé consiste à sécher de l'encre sur le substrat. Le procédé consiste à appliquer une solution de couche de finition sur l'encre séchée. La solution de couche de finition comprend au moins du solvant approprié afin d'obtenir au moins une certaine solubilité du liant. L'invention concerne également un film conducteur qui comprend un substrat, une matrice sur le substrat et une pluralité de nanostructures à l'intérieur de la matrice. La matrice est fournie en tant que résultante d'un liant polymère présent dans une encre qui a transporté les nanostructures qui ont été appliquées et séchées sur le substrat, un matériau de couche de finition séché/durci qui a été appliqué sur la couche d'encre séchée sous forme d'une solution de revêtement qui comprend un polymère et au moins du solvant permettant d'obtenir au moins une certaine solubilité du liant, le liant étant au moins partiellement dissous.</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INKS</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB09vdzCXUO8QxzVXDz9PFVcPMP8nUM8fT342FgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8eH-RgYgaGppYOxoaEycKgCZHyDp</recordid><startdate>20201008</startdate><enddate>20201008</enddate><creator>ALLEMAND, Pierre-Marc</creator><creator>DAI, Haixia</creator><creator>SPAID, Michael</creator><scope>EVB</scope></search><sort><creationdate>20201008</creationdate><title>CONDUCTIVE FILM FORMATION</title><author>ALLEMAND, Pierre-Marc ; DAI, Haixia ; SPAID, Michael</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2020205903A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2020</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INKS</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>ALLEMAND, Pierre-Marc</creatorcontrib><creatorcontrib>DAI, Haixia</creatorcontrib><creatorcontrib>SPAID, Michael</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ALLEMAND, Pierre-Marc</au><au>DAI, Haixia</au><au>SPAID, Michael</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE FILM FORMATION</title><date>2020-10-08</date><risdate>2020</risdate><abstract>A method of forming a conductive film. The method includes applying an ink onto a substrate. The ink includes a plurality of nanostructures formed from an electrically-conductive material and a polymer binder. The method includes drying the ink on the substrate. The method includes applying an overcoat material solution onto the dried ink. The overcoat solution includes at least some solvent suitable to provide at least some solubility of the binder. Also, a conductive film that includes a substrate, a matrix on the substrate, and a plurality of nanostructures within the matrix. The matrix is provided as a resultant of a polymer binder present within an ink that carried the nanostructures that was applied and dried upon the substrate, a dried/cured overcoat material that that was applied on the dried ink layer in the form of a coating solution that included a polymer and at least some solvent to provide at least some solubility of the binder, with the binder being at least partially dissolved.
L'invention concerne un procédé de formation d'un film conducteur. Le procédé consiste à appliquer une encre sur un substrat. L'encre comprend une pluralité de nanostructures formées à partir d'un matériau électroconducteur et d'un liant polymère. Le procédé consiste à sécher de l'encre sur le substrat. Le procédé consiste à appliquer une solution de couche de finition sur l'encre séchée. La solution de couche de finition comprend au moins du solvant approprié afin d'obtenir au moins une certaine solubilité du liant. L'invention concerne également un film conducteur qui comprend un substrat, une matrice sur le substrat et une pluralité de nanostructures à l'intérieur de la matrice. La matrice est fournie en tant que résultante d'un liant polymère présent dans une encre qui a transporté les nanostructures qui ont été appliquées et séchées sur le substrat, un matériau de couche de finition séché/durci qui a été appliqué sur la couche d'encre séchée sous forme d'une solution de revêtement qui comprend un polymère et au moins du solvant permettant d'obtenir au moins une certaine solubilité du liant, le liant étant au moins partiellement dissous.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
title | CONDUCTIVE FILM FORMATION |
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