CONDUCTIVE ADHESIVE AGENT COMPOSITION
The present invention relates to a conductive adhesive agent composition which comprises (A) a conductive filler comprising (a1) metal particles having an average particle diameter of 0.5 to 10 μm and (a2) silver particles having an average particle diameter of 10 to 200 nm and (B) particles of a th...
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| creator | ABE Shintaroh KONDO Takeshi |
| description | The present invention relates to a conductive adhesive agent composition which comprises (A) a conductive filler comprising (a1) metal particles having an average particle diameter of 0.5 to 10 μm and (a2) silver particles having an average particle diameter of 10 to 200 nm and (B) particles of a thermoplastic resin which have an average particle diameter of 2 to 14 μm, wherein the melting point of the thermoplastic resin is 130 to 250°C.
La présente invention concerne une composition d'agent adhésif conducteur qui comprend (A) une charge conductrice comprenant des particules métalliques (a1) ayant un diamètre moyen de particule de 0,5 à 10 µm et (a2) des particules d'argent ayant un diamètre de particule moyen de 10 à 200 nm, et (B) des particules d'une résine thermoplastique qui ont un diamètre de particule moyen de 2 à 14 µm, le point de fusion de la résine thermoplastique étant de 130 à 250°C.
本発明は、平均粒子径０．５～１０μｍの金属粒子（ａ１）と平均粒子径１０～２００ｎｍの銀粒子（ａ２）とを含む導電性フィラー（Ａ）と、平均粒子径２～１４μｍの熱可塑性樹脂の粒子（Ｂ）と、を含有し、熱可塑性樹脂の融点が、１３０～２５０℃である導電性接着剤組成物に関する。 |
| format | Patent |
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La présente invention concerne une composition d'agent adhésif conducteur qui comprend (A) une charge conductrice comprenant des particules métalliques (a1) ayant un diamètre moyen de particule de 0,5 à 10 µm et (a2) des particules d'argent ayant un diamètre de particule moyen de 10 à 200 nm, et (B) des particules d'une résine thermoplastique qui ont un diamètre de particule moyen de 2 à 14 µm, le point de fusion de la résine thermoplastique étant de 130 à 250°C.
本発明は、平均粒子径０．５～１０μｍの金属粒子（ａ１）と平均粒子径１０～２００ｎｍの銀粒子（ａ２）とを含む導電性フィラー（Ａ）と、平均粒子径２～１４μｍの熱可塑性樹脂の粒子（Ｂ）と、を含有し、熱可塑性樹脂の融点が、１３０～２５０℃である導電性接着剤組成物に関する。</description><language>eng ; fre ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200716&DB=EPODOC&CC=WO&NR=2020145170A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200716&DB=EPODOC&CC=WO&NR=2020145170A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ABE Shintaroh</creatorcontrib><creatorcontrib>KONDO Takeshi</creatorcontrib><title>CONDUCTIVE ADHESIVE AGENT COMPOSITION</title><description>The present invention relates to a conductive adhesive agent composition which comprises (A) a conductive filler comprising (a1) metal particles having an average particle diameter of 0.5 to 10 μm and (a2) silver particles having an average particle diameter of 10 to 200 nm and (B) particles of a thermoplastic resin which have an average particle diameter of 2 to 14 μm, wherein the melting point of the thermoplastic resin is 130 to 250°C.
La présente invention concerne une composition d'agent adhésif conducteur qui comprend (A) une charge conductrice comprenant des particules métalliques (a1) ayant un diamètre moyen de particule de 0,5 à 10 µm et (a2) des particules d'argent ayant un diamètre de particule moyen de 10 à 200 nm, et (B) des particules d'une résine thermoplastique qui ont un diamètre de particule moyen de 2 à 14 µm, le point de fusion de la résine thermoplastique étant de 130 à 250°C.
本発明は、平均粒子径０．５～１０μｍの金属粒子（ａ１）と平均粒子径１０～２００ｎｍの銀粒子（ａ２）とを含む導電性フィラー（Ａ）と、平均粒子径２～１４μｍの熱可塑性樹脂の粒子（Ｂ）と、を含有し、熱可塑性樹脂の融点が、１３０～２５０℃である導電性接着剤組成物に関する。</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB19vdzCXUO8QxzVXB08XANBjPcXf1CFJz9fQP8gz1DPP39eBhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfLi_kYGRgaGJqaG5gaOhMXGqADtTJEg</recordid><startdate>20200716</startdate><enddate>20200716</enddate><creator>ABE Shintaroh</creator><creator>KONDO Takeshi</creator><scope>EVB</scope></search><sort><creationdate>20200716</creationdate><title>CONDUCTIVE ADHESIVE AGENT COMPOSITION</title><author>ABE Shintaroh ; KONDO Takeshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2020145170A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ABE Shintaroh</creatorcontrib><creatorcontrib>KONDO Takeshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ABE Shintaroh</au><au>KONDO Takeshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONDUCTIVE ADHESIVE AGENT COMPOSITION</title><date>2020-07-16</date><risdate>2020</risdate><abstract>The present invention relates to a conductive adhesive agent composition which comprises (A) a conductive filler comprising (a1) metal particles having an average particle diameter of 0.5 to 10 μm and (a2) silver particles having an average particle diameter of 10 to 200 nm and (B) particles of a thermoplastic resin which have an average particle diameter of 2 to 14 μm, wherein the melting point of the thermoplastic resin is 130 to 250°C.
La présente invention concerne une composition d'agent adhésif conducteur qui comprend (A) une charge conductrice comprenant des particules métalliques (a1) ayant un diamètre moyen de particule de 0,5 à 10 µm et (a2) des particules d'argent ayant un diamètre de particule moyen de 10 à 200 nm, et (B) des particules d'une résine thermoplastique qui ont un diamètre de particule moyen de 2 à 14 µm, le point de fusion de la résine thermoplastique étant de 130 à 250°C.
本発明は、平均粒子径０．５～１０μｍの金属粒子（ａ１）と平均粒子径１０～２００ｎｍの銀粒子（ａ２）とを含む導電性フィラー（Ａ）と、平均粒子径２～１４μｍの熱可塑性樹脂の粒子（Ｂ）と、を含有し、熱可塑性樹脂の融点が、１３０～２５０℃である導電性接着剤組成物に関する。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | CONDUCTIVE ADHESIVE AGENT COMPOSITION |
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