METHOD FOR CUTTING AN INK STICKER IN A MULTILAYER STRUCTURE AND METHOD FOR PRINTING THE INK STICKER ONTO A SUBSTRATE

The invention concerns a method for cutting an ink sticker (230) situated in a multilayer structure (10) comprising an ink layer (12) between a protective layer (11) and an ink carrier layer (13). The process consists in: - positioning (100) the multilayer structure (10) to be cut in front of a femt...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LESUR, Jean-Luc, GRIGORESCU, Sorin
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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