METHOD FOR CUTTING AN INK STICKER IN A MULTILAYER STRUCTURE AND METHOD FOR PRINTING THE INK STICKER ONTO A SUBSTRATE
The invention concerns a method for cutting an ink sticker (230) situated in a multilayer structure (10) comprising an ink layer (12) between a protective layer (11) and an ink carrier layer (13). The process consists in: - positioning (100) the multilayer structure (10) to be cut in front of a femt...
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| creator | LESUR, Jean-Luc GRIGORESCU, Sorin |
| description | The invention concerns a method for cutting an ink sticker (230) situated in a multilayer structure (10) comprising an ink layer (12) between a protective layer (11) and an ink carrier layer (13). The process consists in: - positioning (100) the multilayer structure (10) to be cut in front of a femtosecond laser device (200) with the protective layer facing said femtosecond laser device; and - kiss cutting (110) the ink layer (12) through the protective layer (11) with a laser beam (210) emitted by the femtosecond laser device (200) in order to produce an ink sticker (230) between the protective layer and the uncut ink carrier layer, with the possibility to cut, partially cut or leave intact the protective layer (11).
L'invention concerne un procédé de découpe d'un autocollant d'encre (230) situé dans une structure multicouche (10) comprenant une couche d'encre (12) entre une couche protectrice (11) et une couche de support d'encre (13). Le procédé consiste à : - positionner (100) la structure multicouche (10) devant être découpée devant un dispositif laser femtoseconde (200) avec la couche protectrice faisant face audit dispositif laser femtoseconde ; et - découper par effleurement (110) la couche d'encre (12) à travers la couche protectrice (11) avec un faisceau laser (210) émis par le dispositif laser femtoseconde (200) afin de produire un autocollant d'encre (230) entre la couche protectrice et la couche de support d'encre non découpée, avec la possibilité de découper, découper partiellement ou laisser intacte la couche protectrice (11). |
| format | Patent |
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L'invention concerne un procédé de découpe d'un autocollant d'encre (230) situé dans une structure multicouche (10) comprenant une couche d'encre (12) entre une couche protectrice (11) et une couche de support d'encre (13). Le procédé consiste à : - positionner (100) la structure multicouche (10) devant être découpée devant un dispositif laser femtoseconde (200) avec la couche protectrice faisant face audit dispositif laser femtoseconde ; et - découper par effleurement (110) la couche d'encre (12) à travers la couche protectrice (11) avec un faisceau laser (210) émis par le dispositif laser femtoseconde (200) afin de produire un autocollant d'encre (230) entre la couche protectrice et la couche de support d'encre non découpée, avec la possibilité de découper, découper partiellement ou laisser intacte la couche protectrice (11).</description><language>eng ; fre</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200625&DB=EPODOC&CC=WO&NR=2020126928A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200625&DB=EPODOC&CC=WO&NR=2020126928A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LESUR, Jean-Luc</creatorcontrib><creatorcontrib>GRIGORESCU, Sorin</creatorcontrib><title>METHOD FOR CUTTING AN INK STICKER IN A MULTILAYER STRUCTURE AND METHOD FOR PRINTING THE INK STICKER ONTO A SUBSTRATE</title><description>The invention concerns a method for cutting an ink sticker (230) situated in a multilayer structure (10) comprising an ink layer (12) between a protective layer (11) and an ink carrier layer (13). The process consists in: - positioning (100) the multilayer structure (10) to be cut in front of a femtosecond laser device (200) with the protective layer facing said femtosecond laser device; and - kiss cutting (110) the ink layer (12) through the protective layer (11) with a laser beam (210) emitted by the femtosecond laser device (200) in order to produce an ink sticker (230) between the protective layer and the uncut ink carrier layer, with the possibility to cut, partially cut or leave intact the protective layer (11).
L'invention concerne un procédé de découpe d'un autocollant d'encre (230) situé dans une structure multicouche (10) comprenant une couche d'encre (12) entre une couche protectrice (11) et une couche de support d'encre (13). Le procédé consiste à : - positionner (100) la structure multicouche (10) devant être découpée devant un dispositif laser femtoseconde (200) avec la couche protectrice faisant face audit dispositif laser femtoseconde ; et - découper par effleurement (110) la couche d'encre (12) à travers la couche protectrice (11) avec un faisceau laser (210) émis par le dispositif laser femtoseconde (200) afin de produire un autocollant d'encre (230) entre la couche protectrice et la couche de support d'encre non découpée, avec la possibilité de découper, découper partiellement ou laisser intacte la couche protectrice (11).</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCjxdQ3x8HdRcPMPUnAODQnx9HNXcPRT8PTzVggO8XT2dg0CshUcFXxDfUI8fRwjgfzgkKBQ55DQIFegQhcFJP0BQZ5-YANCPFxRTPD3C_EHmhEc6gTU6xjiysPAmpaYU5zKC6W5GZTdXEOcPXRTC_LjU4sLEpNT81JL4sP9jQyMDAyNzCyNLBwNjYlTBQB10zmk</recordid><startdate>20200625</startdate><enddate>20200625</enddate><creator>LESUR, Jean-Luc</creator><creator>GRIGORESCU, Sorin</creator><scope>EVB</scope></search><sort><creationdate>20200625</creationdate><title>METHOD FOR CUTTING AN INK STICKER IN A MULTILAYER STRUCTURE AND METHOD FOR PRINTING THE INK STICKER ONTO A SUBSTRATE</title><author>LESUR, Jean-Luc ; GRIGORESCU, Sorin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2020126928A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2020</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>LESUR, Jean-Luc</creatorcontrib><creatorcontrib>GRIGORESCU, Sorin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LESUR, Jean-Luc</au><au>GRIGORESCU, Sorin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR CUTTING AN INK STICKER IN A MULTILAYER STRUCTURE AND METHOD FOR PRINTING THE INK STICKER ONTO A SUBSTRATE</title><date>2020-06-25</date><risdate>2020</risdate><abstract>The invention concerns a method for cutting an ink sticker (230) situated in a multilayer structure (10) comprising an ink layer (12) between a protective layer (11) and an ink carrier layer (13). The process consists in: - positioning (100) the multilayer structure (10) to be cut in front of a femtosecond laser device (200) with the protective layer facing said femtosecond laser device; and - kiss cutting (110) the ink layer (12) through the protective layer (11) with a laser beam (210) emitted by the femtosecond laser device (200) in order to produce an ink sticker (230) between the protective layer and the uncut ink carrier layer, with the possibility to cut, partially cut or leave intact the protective layer (11).
L'invention concerne un procédé de découpe d'un autocollant d'encre (230) situé dans une structure multicouche (10) comprenant une couche d'encre (12) entre une couche protectrice (11) et une couche de support d'encre (13). Le procédé consiste à : - positionner (100) la structure multicouche (10) devant être découpée devant un dispositif laser femtoseconde (200) avec la couche protectrice faisant face audit dispositif laser femtoseconde ; et - découper par effleurement (110) la couche d'encre (12) à travers la couche protectrice (11) avec un faisceau laser (210) émis par le dispositif laser femtoseconde (200) afin de produire un autocollant d'encre (230) entre la couche protectrice et la couche de support d'encre non découpée, avec la possibilité de découper, découper partiellement ou laisser intacte la couche protectrice (11).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR CUTTING AN INK STICKER IN A MULTILAYER STRUCTURE AND METHOD FOR PRINTING THE INK STICKER ONTO A SUBSTRATE |
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