ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND
Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having...
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| creator | KAWAKUSU, Tetsuo KOYANAGI, Hideyuki KANDA, Ryosuke |
| description | Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having an imide bond; and a phosphorous compound having a specific structure.
L'invention fournit une excellente composition d'adhésif qui se révèle excellente en termes d'adhérence, de résistance à la chaleur, de maniabilité et de fiabilité d'isolation, et qui est adaptée à un film adhésif, un film de couverture, un stratifié cuivré, ou similaire. Plus précisément, l'invention concerne une composition d'adhésif qui est caractéristique en ce qu'elle comprend une résine possédant une liaison imide et un composé phosphore de structure spécifique.
接着性、耐熱性、取り扱い性、絶縁信頼性に優れ、接着フィルム、カバーレイフィルム、銅張り積層板等に好適である優れた接着剤組成物を提供する。 イミド結合を有する樹脂および特定構造のリン化合物を含有することを特徴とする接着剤組成物。 |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_WO2020071363A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>WO2020071363A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_WO2020071363A13</originalsourceid><addsrcrecordid>eNrjZPB3dPFwDfYMc1Vw9vcN8A_2DPH091MIDfb0c1fw9PV0cVVw8vdz0XX29wtx9PQDiQYBlfspOPq5KAR4-AcDcZB_aDBEd6ifCw8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ_3NzIwMjAwNzQ2M3Y0NCZOFQAoei_-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND</title><source>esp@cenet</source><creator>KAWAKUSU, Tetsuo ; KOYANAGI, Hideyuki ; KANDA, Ryosuke</creator><creatorcontrib>KAWAKUSU, Tetsuo ; KOYANAGI, Hideyuki ; KANDA, Ryosuke</creatorcontrib><description>Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having an imide bond; and a phosphorous compound having a specific structure.
L'invention fournit une excellente composition d'adhésif qui se révèle excellente en termes d'adhérence, de résistance à la chaleur, de maniabilité et de fiabilité d'isolation, et qui est adaptée à un film adhésif, un film de couverture, un stratifié cuivré, ou similaire. Plus précisément, l'invention concerne une composition d'adhésif qui est caractéristique en ce qu'elle comprend une résine possédant une liaison imide et un composé phosphore de structure spécifique.
接着性、耐熱性、取り扱い性、絶縁信頼性に優れ、接着フィルム、カバーレイフィルム、銅張り積層板等に好適である優れた接着剤組成物を提供する。 イミド結合を有する樹脂および特定構造のリン化合物を含有することを特徴とする接着剤組成物。</description><language>eng ; fre ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200409&DB=EPODOC&CC=WO&NR=2020071363A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200409&DB=EPODOC&CC=WO&NR=2020071363A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWAKUSU, Tetsuo</creatorcontrib><creatorcontrib>KOYANAGI, Hideyuki</creatorcontrib><creatorcontrib>KANDA, Ryosuke</creatorcontrib><title>ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND</title><description>Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having an imide bond; and a phosphorous compound having a specific structure.
L'invention fournit une excellente composition d'adhésif qui se révèle excellente en termes d'adhérence, de résistance à la chaleur, de maniabilité et de fiabilité d'isolation, et qui est adaptée à un film adhésif, un film de couverture, un stratifié cuivré, ou similaire. Plus précisément, l'invention concerne une composition d'adhésif qui est caractéristique en ce qu'elle comprend une résine possédant une liaison imide et un composé phosphore de structure spécifique.
接着性、耐熱性、取り扱い性、絶縁信頼性に優れ、接着フィルム、カバーレイフィルム、銅張り積層板等に好適である優れた接着剤組成物を提供する。 イミド結合を有する樹脂および特定構造のリン化合物を含有することを特徴とする接着剤組成物。</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB3dPFwDfYMc1Vw9vcN8A_2DPH091MIDfb0c1fw9PV0cVVw8vdz0XX29wtx9PQDiQYBlfspOPq5KAR4-AcDcZB_aDBEd6ifCw8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ_3NzIwMjAwNzQ2M3Y0NCZOFQAoei_-</recordid><startdate>20200409</startdate><enddate>20200409</enddate><creator>KAWAKUSU, Tetsuo</creator><creator>KOYANAGI, Hideyuki</creator><creator>KANDA, Ryosuke</creator><scope>EVB</scope></search><sort><creationdate>20200409</creationdate><title>ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND</title><author>KAWAKUSU, Tetsuo ; KOYANAGI, Hideyuki ; KANDA, Ryosuke</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2020071363A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; jpn</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWAKUSU, Tetsuo</creatorcontrib><creatorcontrib>KOYANAGI, Hideyuki</creatorcontrib><creatorcontrib>KANDA, Ryosuke</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWAKUSU, Tetsuo</au><au>KOYANAGI, Hideyuki</au><au>KANDA, Ryosuke</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND</title><date>2020-04-09</date><risdate>2020</risdate><abstract>Provided is an excellent adhesive composition that has excellent adhesiveness, heat-resistance, handling properties, and insulation reliability and is suitable for adhesive film, coverlay film, and copper-plated laminate, etc. This adhesive composition is characterized by containing: a resin having an imide bond; and a phosphorous compound having a specific structure.
L'invention fournit une excellente composition d'adhésif qui se révèle excellente en termes d'adhérence, de résistance à la chaleur, de maniabilité et de fiabilité d'isolation, et qui est adaptée à un film adhésif, un film de couverture, un stratifié cuivré, ou similaire. Plus précisément, l'invention concerne une composition d'adhésif qui est caractéristique en ce qu'elle comprend une résine possédant une liaison imide et un composé phosphore de structure spécifique.
接着性、耐熱性、取り扱い性、絶縁信頼性に優れ、接着フィルム、カバーレイフィルム、銅張り積層板等に好適である優れた接着剤組成物を提供する。 イミド結合を有する樹脂および特定構造のリン化合物を含有することを特徴とする接着剤組成物。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION USING IMIDE BOND-CONTAINING RESIN AND PHOSPHOROUS COMPOUND |
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