MANUFACTURING PROCESS OF LIGHT-EMITTING PART AND LIGHT-EMITTING PART
A manufacturing process of a light-emitting part and a light-emitting part. The manufacturing process of a light-emitting part comprises: step S1, manufacturing a quantum dot film (40); step S2, providing an LED unit, wherein the LED unit comprises at least one LED chip (20); step S3, disposing a fi...
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| creator | ZHOU, Jianhai LAN, Yunjian KANG, Yongyin WANG, Hailin DU, Xiangpeng |
| description | A manufacturing process of a light-emitting part and a light-emitting part. The manufacturing process of a light-emitting part comprises: step S1, manufacturing a quantum dot film (40); step S2, providing an LED unit, wherein the LED unit comprises at least one LED chip (20); step S3, disposing a first transparent adhesive layer (30) on the exposed surface of each LED chip (20); step S4, disposing the quantum dot film (40) on a surface of the first transparent adhesive layer (30) away from the LED chip (20). In the manufacturing process of the light-emitting part, a quantum dot film (40) is first manufactured, and instead of being cured by injecting a quantum dot glue, the quantum dot material distribution in the light-emitting part obtained by this process is more uniform, such that the light-emitting part emits more uniform light.
La présente invention concerne un processus de fabrication d'une pièce électroluminescente et une pièce électroluminescente. Le processus de fabrication d'une pièce électrolumines |
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La présente invention concerne un processus de fabrication d'une pièce électroluminescente et une pièce électroluminescente. Le processus de fabrication d'une pièce électrolumines</description><language>chi ; eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200402&DB=EPODOC&CC=WO&NR=2020063485A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200402&DB=EPODOC&CC=WO&NR=2020063485A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHOU, Jianhai</creatorcontrib><creatorcontrib>LAN, Yunjian</creatorcontrib><creatorcontrib>KANG, Yongyin</creatorcontrib><creatorcontrib>WANG, Hailin</creatorcontrib><creatorcontrib>DU, Xiangpeng</creatorcontrib><title>MANUFACTURING PROCESS OF LIGHT-EMITTING PART AND LIGHT-EMITTING PART</title><description>A manufacturing process of a light-emitting part and a light-emitting part. The manufacturing process of a light-emitting part comprises: step S1, manufacturing a quantum dot film (40); step S2, providing an LED unit, wherein the LED unit comprises at least one LED chip (20); step S3, disposing a first transparent adhesive layer (30) on the exposed surface of each LED chip (20); step S4, disposing the quantum dot film (40) on a surface of the first transparent adhesive layer (30) away from the LED chip (20). In the manufacturing process of the light-emitting part, a quantum dot film (40) is first manufactured, and instead of being cured by injecting a quantum dot glue, the quantum dot material distribution in the light-emitting part obtained by this process is more uniform, such that the light-emitting part emits more uniform light.
La présente invention concerne un processus de fabrication d'une pièce électroluminescente et une pièce électroluminescente. Le processus de fabrication d'une pièce électrolumines</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxdfQLdXN0DgkN8vRzVwgI8nd2DQ5W8HdT8PF09wjRdfX1DAkByzgGhSg4-rlgE-dhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfHh_kYGRgYGZsYmFqaOhsbEqQIAGxQszA</recordid><startdate>20200402</startdate><enddate>20200402</enddate><creator>ZHOU, Jianhai</creator><creator>LAN, Yunjian</creator><creator>KANG, Yongyin</creator><creator>WANG, Hailin</creator><creator>DU, Xiangpeng</creator><scope>EVB</scope></search><sort><creationdate>20200402</creationdate><title>MANUFACTURING PROCESS OF LIGHT-EMITTING PART AND LIGHT-EMITTING PART</title><author>ZHOU, Jianhai ; LAN, Yunjian ; KANG, Yongyin ; WANG, Hailin ; DU, Xiangpeng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2020063485A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng ; fre</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHOU, Jianhai</creatorcontrib><creatorcontrib>LAN, Yunjian</creatorcontrib><creatorcontrib>KANG, Yongyin</creatorcontrib><creatorcontrib>WANG, Hailin</creatorcontrib><creatorcontrib>DU, Xiangpeng</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHOU, Jianhai</au><au>LAN, Yunjian</au><au>KANG, Yongyin</au><au>WANG, Hailin</au><au>DU, Xiangpeng</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURING PROCESS OF LIGHT-EMITTING PART AND LIGHT-EMITTING PART</title><date>2020-04-02</date><risdate>2020</risdate><abstract>A manufacturing process of a light-emitting part and a light-emitting part. The manufacturing process of a light-emitting part comprises: step S1, manufacturing a quantum dot film (40); step S2, providing an LED unit, wherein the LED unit comprises at least one LED chip (20); step S3, disposing a first transparent adhesive layer (30) on the exposed surface of each LED chip (20); step S4, disposing the quantum dot film (40) on a surface of the first transparent adhesive layer (30) away from the LED chip (20). In the manufacturing process of the light-emitting part, a quantum dot film (40) is first manufactured, and instead of being cured by injecting a quantum dot glue, the quantum dot material distribution in the light-emitting part obtained by this process is more uniform, such that the light-emitting part emits more uniform light.
La présente invention concerne un processus de fabrication d'une pièce électroluminescente et une pièce électroluminescente. Le processus de fabrication d'une pièce électrolumines</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | MANUFACTURING PROCESS OF LIGHT-EMITTING PART AND LIGHT-EMITTING PART |
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