MULTILAYER STRUCTURE WITH EMBEDDED SENSING FUNCTIONALITIES AND RELATED METHOD OF MANUFACTURE

Integrated multilayer structure suitable for use in sensing applications is presented. The multilayer structure comprises at least one plastic layer (104), at least one film (102, 102B) layer provided on both sides of the plastic layer, said film layer (102) on a first side of the plastic layer comp...

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Hauptverfasser:	SINIVAARA, Hasse, BRÄYSY, Vinski, SÄÄSKI, Jarmo, ASIKKALA, Janne, KERÄNEN, Antti, HEIKKINEN, Mikko, JUNKKARI, Tuukka, SIMULA, Tomi, PIRKONEN, Minna, TUOVINEN, Heikki, ISOHÄTÄLÄ, Anne, WALLENIUS, Ville
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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