INTEGRATED CIRCUIT PACKAGE COMPRISING ENHANCED ELECTROMAGNETIC SHIELD
Some features pertain to a package, comprising a substrate, an electronic component coupled to the substrate, a mold at least partially surrounding the electronic component and a first shield over the mold, and a second shield over the first shield, the first shield made of a material selected to ha...
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| creator | LU, Chunrong AN, Li KREFFT, Anna Katharina |
| description | Some features pertain to a package, comprising a substrate, an electronic component coupled to the substrate, a mold at least partially surrounding the electronic component and a first shield over the mold, and a second shield over the first shield, the first shield made of a material selected to have a high permeability shield. The package includes an enhanced electromagnetic shield.
Certaines caractéristiques concernent un boîtier, comprenant un substrat, un composant électronique couplé au substrat, un moule entourant au moins partiellement le composant électronique et un premier écran sur le moule, et un second écran sur le premier écran, le premier écran étant constitué d'un matériau choisi pour avoir une protection haute perméabilité. L'emballage comprend un écrab électromagnétique amélioré. |
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Certaines caractéristiques concernent un boîtier, comprenant un substrat, un composant électronique couplé au substrat, un moule entourant au moins partiellement le composant électronique et un premier écran sur le moule, et un second écran sur le premier écran, le premier écran étant constitué d'un matériau choisi pour avoir une protection haute perméabilité. L'emballage comprend un écrab électromagnétique amélioré.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200130&DB=EPODOC&CC=WO&NR=2020019272A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200130&DB=EPODOC&CC=WO&NR=2020019272A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU, Chunrong</creatorcontrib><creatorcontrib>AN, Li</creatorcontrib><creatorcontrib>KREFFT, Anna Katharina</creatorcontrib><title>INTEGRATED CIRCUIT PACKAGE COMPRISING ENHANCED ELECTROMAGNETIC SHIELD</title><description>Some features pertain to a package, comprising a substrate, an electronic component coupled to the substrate, a mold at least partially surrounding the electronic component and a first shield over the mold, and a second shield over the first shield, the first shield made of a material selected to have a high permeability shield. The package includes an enhanced electromagnetic shield.
Certaines caractéristiques concernent un boîtier, comprenant un substrat, un composant électronique couplé au substrat, un moule entourant au moins partiellement le composant électronique et un premier écran sur le moule, et un second écran sur le premier écran, le premier écran étant constitué d'un matériau choisi pour avoir une protection haute perméabilité. L'emballage comprend un écrab électromagnétique amélioré.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQANAsDqL-Q8BZSOMgjsf1TA7bS0lPHEuROIkW6v-jgx_g9Ja3NMSiFDIo1RY544XVdoBnCGQxtV3mniVYkgiC30MNoebUQhBSRttHpqZem8V9fMxl83NltidSjLsyvYYyT-OtPMt7uCbvvHPV0R88VPv_1gc5oCz0</recordid><startdate>20200130</startdate><enddate>20200130</enddate><creator>LU, Chunrong</creator><creator>AN, Li</creator><creator>KREFFT, Anna Katharina</creator><scope>EVB</scope></search><sort><creationdate>20200130</creationdate><title>INTEGRATED CIRCUIT PACKAGE COMPRISING ENHANCED ELECTROMAGNETIC SHIELD</title><author>LU, Chunrong ; AN, Li ; KREFFT, Anna Katharina</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_WO2020019272A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2020</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LU, Chunrong</creatorcontrib><creatorcontrib>AN, Li</creatorcontrib><creatorcontrib>KREFFT, Anna Katharina</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LU, Chunrong</au><au>AN, Li</au><au>KREFFT, Anna Katharina</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTEGRATED CIRCUIT PACKAGE COMPRISING ENHANCED ELECTROMAGNETIC SHIELD</title><date>2020-01-30</date><risdate>2020</risdate><abstract>Some features pertain to a package, comprising a substrate, an electronic component coupled to the substrate, a mold at least partially surrounding the electronic component and a first shield over the mold, and a second shield over the first shield, the first shield made of a material selected to have a high permeability shield. The package includes an enhanced electromagnetic shield.
Certaines caractéristiques concernent un boîtier, comprenant un substrat, un composant électronique couplé au substrat, un moule entourant au moins partiellement le composant électronique et un premier écran sur le moule, et un second écran sur le premier écran, le premier écran étant constitué d'un matériau choisi pour avoir une protection haute perméabilité. L'emballage comprend un écrab électromagnétique amélioré.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | INTEGRATED CIRCUIT PACKAGE COMPRISING ENHANCED ELECTROMAGNETIC SHIELD |
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