POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form aesthetic injection-molded articles. The polyamide compositions may include from 45 wt.% to 75 wt.% of an polyamide, from 2 wt.% to 40 wt.% of an etchable...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SPARKS, Bradley James, RAY, Jacob G, WHITE, Kimberly M, POWERS, Scott E
Format: Patent
Sprache:eng ; fre
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